Semiconductor Substrate Cleaning Composition for Polysiloxane Residue

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Solution Overview

Problem

Existing cleaning agents are ineffective in removing polysiloxane adhesive residue from semiconductor substrates without corroding the substrate, and there is a need for a more efficient cleaning method that can handle high temperatures and stress during the 3-dimensional integration of semiconductor wafers.

Innovation Solution

A cleaning agent composition containing tetrahydrocarbylammonium fluoride and an organic solvent, specifically a lactam compound and a ring-structure-having ether compound, is used to effectively remove polysiloxane adhesive residue without damaging the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional cleaning agents are used to remove polysiloxane adhesive residue, then cleaning effectiveness is insufficient, but substrate corrosion risk increases when stronger cleaners are applied

Engineering Contradiction:

Improvecleaning efficiencyVSAvoidsubstrate corrosion

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The invention changes the chemical parameters of the cleaning agent by using tetrahydrocarbylammonium fluoride with specific chain lengths (C1-C6) combined with ring-structure ether compounds. This specific compositional parameter change enables effective removal of polysiloxane adhesive residue while maintaining substrate integrity, resolving the contradiction between cleaning efficiency and substrate corrosion risk

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention employs a composite cleaning agent system combining tetrahydrocarbylammonium fluoride and ring-structure ether compounds in specific ratios (0.1-30 mass% and 70-99.9 mass% respectively). This composite approach synergistically enhances cleaning effectiveness while the ring-structure ether compound acts as a co-solvent to moderate the overall aggressiveness toward the substrate

Inventive Principle:

Principle #40Composite materials

2Stability of the object's composition

If temporary bonding is strong to withstand polishing stress, then bonding stability improves, but ease of removal after polishing deteriorates

Engineering Contradiction:

Improvebonding stability during polishingVSAvoidease of removal after polishing

Core Design Contradiction:

Stability of the object's compositionVSEase of operation

Solution Approach 1:

The polysiloxane adhesive composition uses specific parameter changes in its molecular structure, including controlled crosslinking density and functional group composition, to achieve temperature-dependent adhesion characteristics. At room temperature, the adhesive maintains strong bonding to withstand polishing stress, while at elevated temperatures (above 150°C), the adhesion strength decreases to enable easy removal

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The adhesive exhibits dynamic adhesion properties that change with temperature conditions. The bonding strength is not static but dynamically adjusts based on thermal conditions: strong at low temperatures for polishing stability, and weak at high temperatures for easy removal, resolving the contradiction between bonding stability and ease of removal

Inventive Principle:

Principle #15Dynamics

3Reliability

If cleaning time is extended to improve residue removal, then cleaning effectiveness increases, but processing time and productivity are reduced

Engineering Contradiction:

Improvecleaning effectivenessVSAvoidcleaning time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The cleaning agent utilizes parameter changes in chemical reactivity by employing tetrahydrocarbylammonium fluoride with optimized alkyl chain lengths. This parameter optimization enables rapid chemical reaction with polysiloxane adhesive residue, achieving complete removal within 1-5 minutes while maintaining high cleaning effectiveness, thus resolving the time-effectiveness contradiction

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The cleaning agent composition achieves high-efficiency removal of polysiloxane adhesive residue on semiconductor substrates in a short period, ensuring substrate integrity and stability under high temperatures and stress conditions.

Implementation Method 1

a cleaning agent composition containing a tetrahydrocarbylammonium fluoride and an organic solvent

Methodology Applied

Scientific EffectChemical reaction: Chemical Bonding

Implementation Method 2

the organic solvent contains a lactam compound represented by formula (1) and a ring-structure-having ether compound

Methodology Applied

Scientific EffectSolvation: Solvation

Data Source

PatentUS20260071152A1Cleaning method

Publication Date: 2026.03.12 NISSAN CHEM CORP

AI summary

A cleaning method that includes removing an adhesive residue remaining on a debonded semiconductor substrate with a cleaning agent composition. The cleaning agent composition contains a tetrahydrocarbylammonium fluoride, a ring-structure-having ether compound that including at least one cycloalkyl (chain alkyl) ether compound, cycloalkyl (branched alkyl) ether compound, or a di(cycloalkly) ether compound, and an organic solvent that includes a lactam compound represented by formula (1), where R101 represents a C1 to C6 alkyl group; and R102 represents a C1 to C6 alkylene group.