Substrate Cleaning Rotation Control to Prevent Liquid Rebound

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The existing substrate cleaning processes suffer from issues such as liquid rebound, contamination, and the occurrence of a 'finger ring phenomenon due to instantaneous liquid supply gaps, leading to treatment failures.

Innovation Solution

A method and apparatus that involve controlled rotation speeds and liquid supply sequences, including high-speed and low-speed rotations, liquid film formation, and sequential liquid replacement, minimizing liquid rebound and contamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If liquid is supplied continuously during substrate rotation, then cleaning effectiveness is improved, but liquid rebound and contamination occur when supply gaps happen

Engineering Contradiction:
Improvecleaning effectivenessVSAvoidliquid rebound and contamination
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The system pre-fills a liquid reservoir before the substrate arrives and maintains a continuous liquid supply during the cleaning process. The liquid reservoir is filled in advance (preliminary action) to ensure no supply gaps occur when the substrate is being cleaned, thereby preventing liquid rebound and contamination while maintaining cleaning effectiveness.

Inventive Principle:
Principle #10Preliminary action

2Loss of substance

If liquid supply is interrupted between treatments, then liquid consumption is reduced, but finger ring phenomenon occurs due to instantaneous supply gaps

Engineering Contradiction:
Improveliquid consumptionVSAvoidsubstrate treatment quality
Core Design Contradiction:
Loss of substanceVSManufacturing precision

Solution Approach 1:

The system maintains continuous liquid supply to the substrate throughout the cleaning process by using a reservoir that is pre-filled and continuously fed. This eliminates interruptions in liquid supply that would otherwise cause finger ring phenomenon, ensuring continuous useful action while managing liquid consumption through efficient reservoir management.

Inventive Principle:
Principle #20Continuity of useful action

3Ease of operation

If high rotation speed is used during liquid supply, then liquid distribution is improved, but liquid may be rebounded off the substrate

Engineering Contradiction:
Improveliquid distributionVSAvoidliquid rebound
Core Design Contradiction:
Ease of operationVSObject-generated harmful factors

Solution Approach 1:

The liquid reservoir is pre-filled to an appropriate level before the cleaning process begins. This preliminary action ensures that liquid is continuously available at the substrate surface even at high rotation speeds, preventing the liquid from being rebounded off while maintaining good liquid distribution across the substrate.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Efficient cleaning with reduced contamination and prevention of liquid rebound and finger ring phenomena, enhancing substrate treatment quality.

Implementation Method 1

a first high-speed rotation operation of rotating the substrate at a first speed; and a first low-speed rotation operation of rotating the substrate at a second speed slower than the first speed

Methodology Applied
Scientific EffectCentrifugal force: Centrifugal Force

Data Source

PatentUS20260054293A1Substrate processing method and substrate processing apparatus
Publication Date: 2026.02.26 SYSTEM ENGINEERING MEGA SOLUTION CO LTD
  • US20260054293A1 patent drawing
  • US20260054293A1 patent drawing
  • US20260054293A1 patent drawing

AI summary

Disclosed is a method of processing a substrate, the method including: a first liquid supplying operation of supplying a first liquid to a top surface of a substrate, in which the first liquid supplying operation includes: a first high-speed rotation operation of rotating the substrate at a first speed; and a first low-speed rotation operation of rotating the substrate at a second speed slower than the first speed, and in the first liquid supplying operation, the first liquid is supplied to a bottom surface of the substrate, and stopping the supply of the first liquid to the bottom surface of the substrate when the substrate is rotating at the second speed.