Substrate Cleaning Apparatus Non-Contact Scrub Tool Maintenance
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Solution Overview
Problem
Conventional contact-type self-cleaning devices for scrub-cleaning tools in semiconductor manufacturing cause back contamination of the tools and substrates during the cleaning process, leading to inefficiencies and reduced throughput.
Innovation Solution
A substrate cleaning apparatus with a self-cleaning device that uses a cleaning fluid, including a mixture of cleaning liquid and high-pressure gas, ejected through nozzles to clean the scrub-cleaning tool in a non-contact manner, preventing back contamination by using a cylindrical design with nozzles arranged along the tool's circumference and a suction passage to manage debris.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a contact-type self-cleaning device using a brush or plate is used to clean the scrub-cleaning tool, then the processing debris can be removed from the tool, but the processing debris is transferred from the cleaning element back to the scrub-cleaning tool and substrate, causing back contamination
Solution Approach 1:
The patent replaces the mechanical contact-type cleaning system (brush or plate physically contacting the scrub-cleaning tool) with a fluid-based cleaning system. Cleaning nozzles eject cleaning fluid (liquid or gas) onto the scrub-cleaning tool surface, and suction nozzles remove debris through negative pressure, eliminating mechanical contact that causes debris transfer and back contamination.
Solution Approach 2:
The patent utilizes pneumatic and hydraulic principles by employing cleaning nozzles to eject high-pressure cleaning fluid (liquid or gas) onto the scrub-cleaning tool for debris removal, and suction nozzles that create negative pressure to extract debris. This fluid-based approach replaces contact mechanical cleaning, preventing the transfer of processing debris back to the tool and substrate.
2Reliability
If the scrub-cleaning tool is transported to a separate self-cleaning device, then the tool can be cleaned, but this requires additional space and time for transport, reducing processing throughput
Solution Approach 1:
The patent merges the self-cleaning device with the substrate cleaning apparatus by positioning the cleaning and suction nozzles adjacent to the scrub-cleaning tool's rotation path within the same processing chamber. The scrub-cleaning tool rotates in place while being cleaned by the nozzles, eliminating the need for separate transport to and from a distant cleaning device, thus maintaining high processing throughput.
Solution Approach 2:
The scrub-cleaning tool serves multiple functions: it cleans the substrate during normal operation and simultaneously receives in-situ cleaning from the nozzles without requiring transport. The self-cleaning system is integrated into the existing apparatus structure, allowing the same space to accommodate both substrate processing and tool cleaning operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The non-contact cleaning method effectively removes processing debris from the scrub-cleaning tool without contaminating it or the substrate, improving processing throughput by eliminating the need for tool transport and reducing contamination risks.
Implementation Method 1
at least one cleaning nozzle configured to eject a cleaning fluid toward the circumferential surface of the scrub-cleaning tool through a gap between the circumferential surface of the scrub-cleaning tool and the inner circumferential surface of the cleaning body
Implementation Method 2
a blow nozzle configured to eject a gas toward the circumferential surface of the scrub-cleaning tool through the gap
Implementation Method 3
a suction passage for sucking a gas from the gap
Data Source
AI summary
A substrate cleaning apparatus including a self-cleaning device is disclosed. The substrate cleaning apparatus includes a self-cleaning device configured to clean a cylindrical scrub-cleaning tool that is rubbed against a substrate surface. The self-cleaning device includes a cleaning body having an inner circumferential surface that is shaped along an circumferential surface of the scrub-cleaning tool, and at least one cleaning nozzle configured to eject a cleaning fluid toward the circumferential surface of the scrub-cleaning tool through a gap between the circumferential surface of the scrub-cleaning tool and the inner circumferential surface of the cleaning body.