Substrate Cleaning Device Self-Cleaning Module Contamination Monitoring
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Solution Overview
Problem
Existing substrate cleaning technologies face challenges in ensuring the cleanliness of cleaning members, leading to potential cross-contamination and defects in substrate processing, as the contamination level of cleaning members is difficult to monitor and manage effectively.
Innovation Solution
A substrate cleaning device with a self-cleaning module that uses a second cleaning liquid to remove contaminants from the cleaning member, with a measurement module to assess the physical properties of the waste liquid, allowing for estimation of fine particles on the substrate and determination of the cleaning member's contamination level, thereby optimizing cleaning operations and scheduling replacements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a cleaning member is used repeatedly to clean substrates, then productivity increases, but the cleaning member becomes contaminated and causes cross-contamination
Solution Approach 1:
The cleaning member performs self-cleaning by contacting a self-cleaning member (such as a cloth or pad) that removes contaminants from its surface. This self-service mechanism allows the cleaning member to maintain cleanliness without requiring manual intervention or replacement after each use, thereby preventing cross-contamination while sustaining high productivity
Solution Approach 2:
A measurement module monitors the physical property values (such as particle count, pH, or conductivity) of the cleaning liquid or waste liquid to determine the contamination level of the cleaning member. Based on this feedback, the system can trigger self-cleaning operations or alert operators to replace the cleaning member before cross-contamination occurs
2Object-affected harmful factors
If self-cleaning is performed frequently to maintain cleanliness, then cross-contamination is reduced, but time and resources are consumed
Solution Approach 1:
The measurement module continuously or periodically monitors the contamination level of the cleaning member by measuring physical property values of the cleaning liquid. Self-cleaning is triggered only when the contamination level exceeds a predetermined threshold, optimizing the balance between preventing cross-contamination and minimizing self-cleaning time
Solution Approach 2:
Instead of continuous self-cleaning, the system performs self-cleaning at periodic intervals or when contamination reaches a critical level. This periodic action reduces the total time spent on self-cleaning while still effectively preventing cross-contamination
3Reliability
If a new cleaning member is used, then cleaning effectiveness is maximized, but cost and waste increase due to frequent replacement
Solution Approach 1:
The cleaning member is equipped with a self-cleaning function that restores its effectiveness by removing accumulated contaminants. This extends the usable life of the cleaning member without compromising cleaning effectiveness, thereby reducing waste and replacement frequency
Solution Approach 2:
Instead of discarding the cleaning member after a single use, the system recovers its cleaning capability through self-cleaning operations. The cleaning member is reused multiple times until it reaches a point where replacement is necessary, optimizing the balance between effectiveness and waste reduction
4Object-affected harmful factors
If contamination of the cleaning member is monitored continuously, then cross-contamination is prevented, but device complexity increases
Solution Approach 1:
A measurement module with simple sensors monitors physical property values (such as particle count, pH, or electrical conductivity) of the cleaning liquid to assess contamination level. This feedback is processed by a controller that compares the measured values against predetermined thresholds and triggers self-cleaning or replacement actions, providing effective monitoring without excessive complexity
Solution Approach 2:
Instead of complex mechanical or visual inspection methods, the system uses electrical or optical sensors to measure physical property values of the cleaning liquid. This substitution of mechanical inspection with field-based measurement simplifies the monitoring system while maintaining effective contamination detection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively monitors and maintains the cleanliness of cleaning members, reducing the risk of cross-contamination and improving the quality of substrate cleaning by determining the appropriate operating conditions and timing for self-cleaning and member replacement based on measured physical properties.
Implementation Method 1
a self-cleaning member configured to come into sliding contact with the substrate cleaning member at a retreat position separated from the substrate holder, and performs self-cleaning on the substrate cleaning member
Implementation Method 2
a measurement module configured to measure a physical property value of a waste liquid of the second cleaning liquid used for the self-cleaning of the substrate cleaning member
Data Source
AI summary
According to one embodiment of the present disclosure, provided is a substrate cleaning device including: a substrate holder configured to hold a substrate; a substrate cleaning member configured to come into sliding contact with the held substrate, and clean the substrate using a first cleaning liquid supplied from a first nozzle; a self-cleaning member configured to come into sliding contact with the substrate cleaning member at a retreat position separated from the substrate holder, and performs self-cleaning on the substrate cleaning member using a second cleaning liquid supplied from a second nozzle; a measurement module configured to measure a physical property value of a waste liquid of the second cleaning liquid used for the self-cleaning of the substrate cleaning member, and a controller configured to estimate a number of fine particles adhering to the cleaned substrate based on the physical property value of the waste liquid.