Two-Stage Substrate Cleaning With Recovered Solution Reuse

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Solution Overview

Problem

Conventional substrate cleaning methods using recovered cleaning solutions with lower cleanliness struggle to effectively remove particles from substrates, as they have reduced effectiveness in cleaning processes.

Innovation Solution

A substrate processing method that employs a two-stage cleaning approach, using a first cleaning solution with high cleanliness followed by a second cleaning solution with lower cleanliness, along with controlled supply timings and rinse processing using functional water, to enhance particle removal efficiency while reducing the amount of new cleaning solution required.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of substance

If a recovered cleaning solution with lower cleanliness is used for substrate cleaning, then the cost of cleaning is reduced and new solution usage is minimized, but the particle removal effectiveness deteriorates

Engineering Contradiction:
Improvecleaning solution consumptionVSAvoidparticle removal effectiveness
Core Design Contradiction:
Loss of substanceVSManufacturing precision

Solution Approach 1:

The cleaning process is divided into two sequential stages: first using a high cleanliness cleaning solution to remove the majority of particles, then using a recovered cleaning solution with lower cleanliness for secondary cleaning. This segmentation allows each cleaning solution to be used in the most appropriate stage, optimizing both particle removal effectiveness and solution utilization.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The high cleanliness cleaning solution is applied first to perform preliminary particle removal before the recovered cleaning solution is used. This preliminary action ensures that the majority of particles are removed when the cleaning solution has maximum effectiveness, allowing the recovered solution to handle remaining particles efficiently.

Inventive Principle:
Principle #10Preliminary action

2Manufacturing precision

If only high cleanliness cleaning solution is used for substrate cleaning, then particle removal effectiveness is maximized, but the cost of cleaning increases and new solution consumption increases

Engineering Contradiction:
Improveparticle removal effectivenessVSAvoidcleaning solution consumption
Core Design Contradiction:
Manufacturing precisionVSLoss of substance

Solution Approach 1:

Instead of discarding the cleaning solution after a single use, the system recovers and reuses the cleaning solution in a secondary cleaning stage. This recovery process extends the utilization of the cleaning solution, reducing overall consumption and cost while maintaining effective particle removal through the two-stage approach.

Inventive Principle:
Principle #34Discarding and recovering

Solution Approach 2:

The recovered cleaning solution, which has partial cleaning capability compared to fresh solution, is strategically applied in the second cleaning stage. This partial action is sufficient for removing remaining particles after the primary cleaning, optimizing resource usage without compromising overall cleaning effectiveness.

Inventive Principle:
Principle #16Partial or excessive action

3Loss of substance

If a two-stage cleaning process with different cleanliness solutions is implemented, then particle removal effectiveness is maintained while cleaning solution consumption is reduced, but the device complexity increases

Engineering Contradiction:
Improvecleaning solution consumptionVSAvoidcleaning process complexity
Core Design Contradiction:
Loss of substanceVSDevice complexity

Solution Approach 1:

The cleaning system is designed to handle multiple types of cleaning solutions (fresh and recovered) through a unified processing platform. The substrate processing apparatus can accommodate different cleanliness levels of cleaning solutions without requiring separate dedicated systems, reducing overall device complexity while enabling the two-stage cleaning approach.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS11769661B2Substrate processing method and substrate processing apparatus
Publication Date: 2023.09.26 TOKYO ELECTRON LTD
  • US11769661B2 patent drawing
  • US11769661B2 patent drawing
  • US11769661B2 patent drawing

AI summary

A substrate processing method includes a first cleaning process and a second cleaning process. In the first cleaning process, a substrate is cleaned with a first cleaning solution. In the second cleaning process, the substrate is cleaned with a second cleaning solution having a lower cleanliness than the first cleaning solution after the first cleaning process.