Dual-Support Substrate Cleaning for Friction-Free Spray Targeting
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Solution Overview
Problem
Existing substrate cleaning technologies risk substrate damage due to friction with rotating pins and can spread cleaning solutions to undesirable areas, leading to inefficiencies and potential damage to the substrate surface.
Innovation Solution
A substrate cleaning apparatus with dual support units and nozzle units that rotate around a central axis, allowing for non-contact cleaning of the substrate surface by spraying cleaning fluid onto specific areas without inversion, minimizing friction and solution spread.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a rotating pin is used to clean the substrate by rubbing against the bevel edge, then the substrate can be cleaned, but friction damage occurs to the substrate
Solution Approach 1:
The patent replaces the mechanical rubbing action of a rotating pin with a spray-based cleaning system. Nozzles spray cleaning solution onto the substrate surface, eliminating direct mechanical contact and friction between the cleaning tool and substrate, thereby preventing friction damage while maintaining cleaning effectiveness
Solution Approach 2:
The invention uses pneumatic or hydraulic spray nozzles to deliver cleaning solution to the substrate surface. This fluid-based delivery system replaces solid mechanical contact, allowing cleaning without friction-induced damage to the substrate
2Reliability
If cleaning solution is sprayed on the upper surface of the substrate, then cleaning is achieved, but the solution spreads to undesirable areas and damages the substrate surface
Solution Approach 1:
The patent employs multiple nozzles positioned at different locations and angles to spray cleaning solution onto specific target areas of the substrate. The spray direction and positioning are controlled to confine the cleaning solution to the intended cleaning zones, preventing spread to undesirable areas while maintaining effective local cleaning
Solution Approach 2:
The cleaning system is divided into multiple independent nozzle units, each responsible for a specific area of the substrate. This segmentation allows precise control over where cleaning solution is applied, preventing unwanted spread between different substrate regions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively cleans substrate surfaces without contact damage and solution spread, ensuring stable and efficient removal of contaminants while preventing unwanted fluid dispersion.
Implementation Method 1
a first nozzle unit configured to spray a cleaning fluid upward at an area within the second radius onto the first cleaning area of the substrate
Data Source
AI summary
Provided is a substrate cleaning apparatus including a first support unit having a first support surface extending to a first radius and configured to support a substrate at a first cleaning area of the substrate, the first support unit configured to rotate around a central axis, a second support unit having a second support surface extending from a second radius larger than the first radius to a third radius larger than the second radius and configured to support the substrate at a second cleaning area, and configured to rotate around the central axis, a first nozzle unit configured to spray cleaning fluid onto the first cleaning area of the substrate when the substrate is supported by the second support unit, and a second nozzle unit configured to spray the cleaning fluid onto the second cleaning area of the substrate when the substrate is supported by the first support unit.