Substrate Cleaning Chuck Layout for Contamination and Static Control
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Solution Overview
Problem
Existing substrate processing systems face challenges in effectively removing contaminants and preventing static electricity on substrates after processing, which can lead to contamination spread and increased system volume.
Innovation Solution
A substrate processing system incorporating a substrate cleaning device with a cleaning unit equipped with a cleaning chuck and nozzles that use de-ionized water and gases like nitrogen and carbon dioxide to clean substrates before loading, positioned between the cluster module and load port, ensuring thorough cleaning and static prevention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a substrate cleaning device is added between the cluster module and load port, then cleaning effectiveness is improved, but device complexity increases
Solution Approach 1:
The cleaning device is nested within the existing substrate processing system structure, with the cleaning chuck integrated into the chamber and nozzles positioned around it. This nesting approach allows the cleaning function to be added without requiring a completely separate external cleaning system, thereby improving cleaning effectiveness while minimizing the increase in overall device complexity.
Solution Approach 2:
The chamber is designed to perform multiple functions: substrate processing in the main processing area and substrate cleaning in the same chamber using the cleaning chuck and nozzles. This multi-functionality allows the system to achieve improved cleaning effectiveness without adding entirely separate cleaning equipment, thus avoiding excessive complexity increase.
2Reliability
If multiple nozzles spraying different fluids are used, then cleaning effectiveness is improved, but device complexity increases
Solution Approach 1:
The nozzle system is segmented into multiple independent nozzles, each responsible for spraying a specific fluid (DIW, nitrogen, carbon dioxide) at specific positions around the cleaning chuck. This segmentation allows each nozzle to be optimized for its specific function while maintaining overall system manageability, achieving improved cleaning effectiveness without excessive complexity.
Solution Approach 2:
Different nozzles are positioned at different locations around the cleaning chuck, with each nozzle delivering a specific fluid type (DIW for washing, nitrogen for drying, carbon dioxide for static elimination) to specific areas of the substrate. This local quality approach ensures that each region of the substrate receives the appropriate cleaning treatment, improving overall cleaning effectiveness while keeping the nozzle system organized and manageable.
3Object-affected harmful factors
If carbon dioxide is used to eliminate static electricity, then contamination prevention is improved, but gas consumption increases
Solution Approach 1:
The carbon dioxide nozzle is positioned to spray gas onto the substrate before the substrate is transferred to the load port. This preliminary action eliminates static electricity buildup during the critical handling phase, preventing contamination without requiring continuous gas consumption. The gas is applied only when needed, optimizing both contamination prevention and gas usage efficiency.
Solution Approach 2:
Carbon dioxide serves as an intermediary substance that transfers the static elimination function from an electrical discharge system to a gas-phase neutralization process. The CO2 gas acts as a mediator to neutralize static charges on the substrate surface through ionic conduction, providing effective static elimination with controlled and relatively low gas consumption compared to continuous electrical field methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively removes contaminants and prevents static electricity on substrates, minimizing contamination spread and reducing system volume by integrating cleaning before transfer and using carbon dioxide to neutralize static charges.
Implementation Method 1
a lower cleaning nozzle spraying fluid toward the substrate on the cleaning chuck
Implementation Method 2
using carbon dioxide to neutralize static charges
Data Source
AI summary
A substrate processing system includes a cluster module having substrate processing devices, a load port through which a substrate is loaded, and a substrate cleaning device between the cluster module and the load port, the substrate cleaning device being configured to clean the substrate processed in the substrate processing devices, and the substrate cleaning device including a substrate cleaner having a cleaning chuck to support the substrate, and a cleaning nozzle configured to spray a fluid toward the cleaning chuck.