Semiconductor Substrate Cleaning via Supercritical Fluid and Annealing
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Solution Overview
Problem
Current semiconductor device fabrication processes face challenges in effectively removing defect particles produced by supercritical fluids, which can lead to contamination and damage during the wet and dry cleaning processes.
Innovation Solution
A method and apparatus that utilize a combination of wet and dry cleaning processes, where a supercritical fluid is used to remove moisture and defect particles from semiconductor substrates, involving a cleaning apparatus with modules for substrate loading, wet cleaning, dehumidification, and annealing to prevent particle formation and ensure cleanliness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a supercritical fluid is used to remove moisture from the substrate, then moisture removal efficiency is improved, but defect particles are produced on the substrate surface
Solution Approach 1:
The patent converts the harmful defect particles produced by supercritical fluid into removable byproducts by introducing an annealing process that heats the substrate to decompose and volatilize these particles, transforming the contamination problem into a controlled removal process
Solution Approach 2:
The patent extracts the harmful defect particles from the substrate by using a separate annealing module that applies heat to volatilize and remove the particles without affecting the moisture removal function of the supercritical fluid
2Object-generated harmful factors
If wet cleaning process is used to remove particles from substrate, then particle removal is effective, but moisture remains on the substrate
Solution Approach 1:
The patent changes the physical state and properties of the cleaning medium by transitioning from liquid cleaning solutions to supercritical fluid, which provides both cleaning capability and moisture removal through its unique properties at supercritical conditions
3Object-generated harmful factors
If multiple cleaning modules are added to remove defect particles, then cleaning effectiveness is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple functions (supercritical fluid supply for moisture removal, heating for particle removal, and substrate transfer) into an integrated cleaning apparatus with a unified chamber structure, reducing overall system complexity while maintaining cleaning effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively removes both first particles from trenches and second particles formed on the substrate surface by supercritical fluids, preventing contamination and ensuring the quality of semiconductor devices by using a supercritical fluid and annealing to decompose and remove particles without damaging the substrate.
Implementation Method 1
providing a supercritical fluid onto the substrate to remove moisture from the substrate
Implementation Method 2
the buffer unit includes an annealing portion configured to heat the substrate and to remove defect particles produced on the substrate by the supercritical fluid
Data Source
AI summary
Disclosed are a method for cleaning a substrate, an apparatus for cleaning a substrate, and a method for fabricating a semiconductor device using the same. The method may include cleaning a substrate in a wet process, providing a supercritical fluid onto the substrate to remove moisture from the substrate, and cleaning the substrate in a dry process to remove defect particles from a substrate, which are produced by the supercritical fluid.