Substrate Cleaning Timing Control for Throughput Optimization
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Solution Overview
Problem
Current substrate processing apparatuses face inefficiencies in the cleaning step, leading to reduced throughput due to delays in initiating the cleaning process and potential adverse effects from premature contact of cleaning devices with substrates before reaching the required rotating speed.
Innovation Solution
The apparatus includes a control unit that synchronizes the movement and rotation of cleaning devices with the substrate, ensuring the cleaning device starts moving to the cleaning position either simultaneously or shortly after substrate rotation begins, and adjusts timing based on travel and arrival times to avoid premature contact, thereby optimizing the cleaning process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the cleaning device starts moving to the cleaning position only after the substrate reaches the predetermined rotating speed, then the substrate can be cleaned without adverse effects, but the time to initiate cleaning increases and throughput decreases
Solution Approach 1:
The control unit initiates the movement of the cleaning device to the cleaning position before the substrate reaches the predetermined rotating speed. This preliminary action allows the cleaning device to be in position and ready to contact the substrate immediately when the substrate reaches the cleaning position, thereby reducing waiting time and improving throughput while maintaining cleaning quality through precise timing control.
Solution Approach 2:
The control unit monitors the rotating speed of the substrate and uses this feedback information to precisely control the timing of the cleaning device's movement and contact. By continuously monitoring substrate rotation speed and adjusting the cleaning device's timing accordingly, the system ensures the substrate is cleaned at the optimal moment without adverse effects, resolving the contradiction between reliability and productivity.
2Productivity
If the cleaning device starts moving earlier to improve throughput, then productivity increases, but the substrate may be contacted before reaching the required rotating speed causing adverse effects
Solution Approach 1:
The control unit continuously monitors the substrate's rotating speed and uses this real-time feedback to precisely control when the cleaning device contacts the substrate. This feedback mechanism ensures that even though the cleaning device starts moving earlier to improve throughput, the actual contact timing is optimized based on the substrate's rotation state, preventing adverse effects while maintaining high productivity.
Solution Approach 2:
The system dynamically adjusts the timing of the cleaning device's movement and contact based on the substrate's rotating speed. Rather than using fixed timing, the control unit modulates the cleaning device's action according to the substrate's rotational state, allowing the system to adapt to varying conditions and prevent harmful effects while maximizing throughput.
3Manufacturing precision
If the cleaning device waits for substrate rotation to reach predetermined speed before moving, then cleaning precision is maintained, but loss of time increases
Solution Approach 1:
The cleaning device begins moving to the cleaning position before the substrate reaches the predetermined rotating speed. This preliminary action eliminates the waiting time that would otherwise be required for the substrate to reach the target speed, thereby reducing the overall cleaning cycle time while maintaining cleaning precision through controlled contact timing.
Solution Approach 2:
The cleaning device maintains continuous motion toward the cleaning position without idle waiting periods. By eliminating the pause that would occur while waiting for the substrate to reach the predetermined speed, the system ensures continuous useful action, reducing time loss while preserving cleaning precision through precise contact timing control.
Data Source
AI summary
A substrate processing apparatus has a substrate rotating device 10, 20 for holding and rotating a substrate W, a cleaning device 41 configured to clean a substrate W which is rotated by the substrate rotating device 10, 20 at predetermined rotating speed, a movement device 42 configured to move the cleaning device 41 between a cleaning position P3 and a separate position P2, and a control unit 64. The control unit 64 controls the movement device 42 so that the cleaning device 41 located at the separate position P2 starts moving toward the cleaning position P3 before a rotating speed of the substrate W held by the substrate rotating device 10, 20 reaches the predetermined rotating speed and the cleaning device 41 reaches the cleaning position P3 after a rotating speed of the substrate W reaches the predetermined rotating speed. Therefore, it is possible to improve the throughput in the substrate cleaning step.