Substrate Coating Edge Solidification via Gas Injection

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Solution Overview

Problem

During substrate processing, the coating on the inner region of a semiconductor substrate can spread to the peripheral region due to centrifugal force during dry processing, leading to potential adherence issues with transport mechanisms.

Innovation Solution

A substrate processing method and apparatus that involves forming a coating on the substrate's upper surface, applying a stripping agent to the peripheral region while rotating, and injecting a gas towards the boundary between the peripheral and inner regions to accelerate solidification of the coating's outer edge portion, thereby preventing the spread of the coating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a coating is formed on the inner region of the substrate and dry processing is performed, then the coating fills clearance in the structure effectively, but the coating spreads to the peripheral region due to centrifugal force during high-speed rotation

Engineering Contradiction:

Improvecoating filling clearanceVSAvoidcoating spread to peripheral region

Core Design Contradiction:

Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

A gas (such as nitrogen or carbon dioxide) is injected toward the peripheral region before or during the high-speed rotation phase. This preliminary gas injection creates a protective gas layer that prevents the coating material from spreading radially outward to the peripheral region during centrifugal force action, while still allowing the coating to fill clearance in the inner region structure effectively

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The injected gas acts as an intermediary substance between the coating material and the peripheral region. This gas barrier intercepts the coating material that would otherwise spread due to centrifugal force, preventing contamination of the peripheral region while maintaining the coating's ability to fill structural clearance in the inner region

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If the substrate is rotated at high speed for dry processing, then liquid removal is efficient, but the coating on the inner region spreads radially outward by centrifugal force

Engineering Contradiction:

Improveliquid removal efficiencyVSAvoidradial spread of coating

Core Design Contradiction:

ProductivityVSObject-generated harmful factors

Solution Approach 1:

Gas injection is performed before or during the high-speed rotation to establish a protective gas barrier in advance. This preliminary action prevents the coating from spreading while the substrate rotates at high speed for efficient liquid removal through centrifugal force

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The centrifugal force that causes harmful coating spread is also utilized beneficially for efficient liquid removal. By injecting gas to counteract the harmful effect, the beneficial effect of high-speed rotation for liquid removal is preserved and enhanced

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively suppresses the spread of the coating from the inner region to the peripheral region, ensuring clean transport and preventing soiling of substrate handling mechanisms.

Implementation Method 1

injecting a gas toward a boundary portion between the peripheral region of the upper surface of the substrate and an inner region that is located inward of the peripheral region, to accelerate solidification of an outer edge portion of the coating formed on the inner region

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

the coating on the inner region of a semiconductor substrate can spread to the peripheral region due to centrifugal force during dry processing

Methodology Applied

Scientific EffectCentrifugal force: Centrifugal Force

Data Source

PatentUS10950466B2Substrate processing method and substrate processing apparatus

Publication Date: 2021.03.16 SCREEN HOLDINGS CO LTD

AI summary

A filler solution is supplied to an upper surface of a substrate, forming a coating that is a film of the filler solution. Clearance in the structure on the upper surface of the substrate is filled with the filler solution. Then, a stripping solution is applied to a peripheral region of the upper surface of the substrate, to strip off a portion of the coating formed on the peripheral region. Also, a gas is injected toward a boundary portion between the peripheral region and an inner region of the upper surface of the substrate, to accelerate solidification of an outer edge portion of the coating formed on the inner region, to suppress the spread of the coating from the inner region to the peripheral region. A substrate holder/rotator, fluid supplies, and a gas injection part are provided to carry out the above process.