Substrate Coating Exhaust Pressure Control for Residue Removal
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Solution Overview
Problem
The issue of liquid film formation on the bottom surface of substrates during coating processes leads to contamination and non-uniform treatment, with residues adhering to the treating apparatus and causing particle contamination in subsequent processes.
Innovation Solution
A substrate treating apparatus and method that involves controlling the exhausting pressure of the treating space during different stages of the process, such as coating, cleaning, and drying, to minimize contamination by using distinct liquids for coating and cleaning, and applying these liquids to specific regions of the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If cleaning liquid is sprayed onto the bottom surface of the rotating substrate to remove liquid film, then the liquid film removal effectiveness is improved, but residue attaches to the cup body inner wall and rebounds to contaminate the substrate
Solution Approach 1:
The harmful residue is extracted and removed from the system by increasing exhaust pressure during the cleaning process, preventing it from attaching to the cup body inner wall and rebounding to contaminate the substrate
Solution Approach 2:
The exhaust pressure parameter is changed and increased during the cleaning process to enhance the removal of cleaning liquid residue from the substrate surface, preventing residue attachment to the apparatus
2Productivity
If the substrate rotates during cleaning to enhance liquid film removal, then the cleaning efficiency is improved, but centrifugal force intensifies residue attachment to the cup body
Solution Approach 1:
The centrifugal force that causes residue attachment is converted into a beneficial effect by increasing exhaust pressure, which uses the same rotational motion to enhance residue removal from the substrate surface while preventing cup body contamination
3Manufacturing precision
If exhaust pressure is increased during cleaning to remove residue, then substrate cleanliness is improved, but energy consumption increases
Solution Approach 1:
The exhaust pressure is applied periodically and selectively during the cleaning process rather than continuously, increasing pressure only when needed to remove residue while maintaining lower pressure during other phases to reduce overall energy consumption
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method and apparatus ensure uniform treatment of substrates by minimizing contamination on the substrate being treated and reducing particle contamination for subsequent substrates without requiring structural changes to the facility.
Implementation Method 1
an atmosphere of the treating space is exhausted while the coating of the substrate and the cleaning of the substrate is performed, and an exhausting pressure of the treating space during the coating of the substrate is different from an exhausting pressure of the treating space during the cleaning of the substrate
Implementation Method 2
cleaning a substrate by supplying a second liquid to remove a portion of the first liquid remaining on a specific region of the substrate
Data Source
AI summary
The inventive concept provides a substrate treating method at a treating space. The substrate treating method includes coating a substrate with a first liquid by supplying the first liquid to the substrate; and cleaning a substrate by supplying a second liquid to remove a portion of the first liquid remaining on a specific region of the substrate, the second liquid being different from the first liquid, and wherein an atmosphere of the treating space is exhausted while the coating of the substrate and the cleaning of the substrate is performed, and an exhausting pressure of the treating space during the coating of the substrate is different from an exhausting pressure of the treating space during the cleaning of the substrate.