Double-Sided Substrate Coating via Sacrificial Layer Removal
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Solution Overview
Problem
It is challenging to prevent substrates, such as glass, from accumulating contaminants during the sputtering process, especially when they come into contact with transport rollers, as certain coatings can exacerbate minor traces of contact, leading manufacturers to avoid coating surfaces that have been conveyed over rollers.
Innovation Solution
A method involving the use of a sacrificial coating deposited on the surface in contact with transport rollers, which is later removed while leaving intact a functional coating on the opposite surface, allowing for coating of both sides of the substrate without unwanted traces of contact, using a sequence of sputtering steps and a removing station to maintain coating integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If substrates are conveyed across transport rollers during sputtering, then substrate handling and coating process are enabled, but contaminant accumulation and unwanted contact traces occur on the substrate surface
Solution Approach 1:
A sacrificial coating layer is deposited on the substrate surface before sputtering. This intermediate layer serves as a mediator that protects the substrate from direct contact contamination with transport rollers. The sacrificial coating can be selectively removed afterward, taking contaminants with it while leaving the functional coating intact.
Solution Approach 2:
The sacrificial coating is applied in advance before the substrate undergoes sputtering and transport roller contact. This preliminary protective layer prevents contaminant accumulation on the substrate surface during handling, allowing the substrate to be conveyed without direct contact between the rollers and the substrate surface.
2Productivity
If both sides of substrate are coated using sputtering, then coating productivity is improved, but contact traces on roller-contact surface are exaggerated by certain coatings
Solution Approach 1:
The sacrificial coating acts as a protective intermediary on the surface that contacts transport rollers during double-sided sputtering. This allows both sides to be coated efficiently while the sacrificial layer prevents contact traces from forming on the roller-contact surface, maintaining surface quality.
Solution Approach 2:
The method involves changing the surface parameters by introducing a sacrificial coating layer with specific properties (thickness, material composition) that differs from both the substrate and the functional coating. This parameter change enables the surface to withstand roller contact without contamination, while allowing subsequent removal of the sacrificial layer to reveal a clean surface.
3Reliability
If sacrificial coating is used to protect substrate surface, then coating integrity is maintained, but additional process steps and complexity are introduced
Solution Approach 1:
A sacrificial coating layer is deposited on the substrate surface before sputtering. This intermediate layer serves as a mediator that protects the substrate from direct contact contamination with transport rollers. The sacrificial coating can be selectively removed afterward, taking contaminants with it while leaving the functional coating intact.
Solution Approach 2:
The sacrificial coating is a temporary protective layer that is intentionally discarded after serving its protective function. It is removed in a separate step after the functional coating is applied, allowing the removal of contaminants while preserving the permanent functional coating on the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the coating of both sides of a substrate without leaving residues from transport roller contact, maintaining the functional properties and appearance of the coatings, including transparency and conductivity, while preventing contamination from transport rollers.
Implementation Method 1
A sputtering method for coating both sides of a substrate is disclosed.
Data Source
Figure 1A~1
Figure 2A~2
Figure 3
AI summary
A method of depositing coating onto both sides of a substrate comprising the sequential steps of -providing a substrate having a first surface and a second surface, -providing a production line comprising a series of sputtering chambers and a plurality of transport rollers for conveying the substrate along the production line, the series of sputtering chambers comprising one or more upper targets positioned above the plurality of transport rollers and one or more lower targets positioned beneath the plurality of transport rollers, -positioning the substrate on the production line such that the first surface is oriented toward said one or more upper targets and the second surface contacts two or more of the plurality of transport rollers, -upwardly sputtering said one or more lower targets to deposit a sacrificial coating onto the second surface and downwardly sputtering said one or more upper targets to deposit a first functional coating onto the first surface, -positioning the substrate on the production line such that the second surface is oriented toward said one or more upper targets and the first surface contacts two or more of the plurality of transport rollers, -removing the sacrificial coating from the second surface while leaving intact the first functional coating on the first surface and -downwardly sputtering said one or more upper targets to deposit a second functional coating onto the second surface.