Substrate Process Component Recycling via Controlled Mechanical Cutting
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Solution Overview
Problem
Chemical cleaning methods for recycling substrate process components in semiconductor processing chambers degrade the components and result in shortened service life, along with the generation of toxic waste, especially when dealing with high thermal conductivity materials.
Innovation Solution
A mechanical cutting process using a machining tool controlled by a controller to remove residue layers from substrate process components, maintaining pre-defined reference dimensions to prevent degradation and minimize material loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If chemical cleaning is used to remove residue from substrate process components, then the residue is effectively removed, but the substrate process components are degraded and service life is shortened
Solution Approach 1:
The patent replaces chemical cleaning methods with mechanical removal methods (such as scraping, brushing, or blasting) to remove residue from substrate process components. This substitution eliminates the degrading chemical reactions between cleaning agents and the component materials while still achieving effective residue removal through physical mechanical action.
Solution Approach 2:
The patent introduces an intermediary mechanical removal step between residue deposition and component degradation. Instead of allowing chemicals to directly contact and react with the substrate process components, a mechanical intermediary (such as a removable coating or protective layer) is used to facilitate residue removal without chemical degradation of the underlying component.
2Loss of substance
If chemical cleaning is used to remove deposition materials from aluminum substrate process components, then the deposition materials are removed, but the aluminum components are substantially degraded
Solution Approach 1:
The patent replaces chemical etching or dissolution methods with mechanical removal techniques specifically tailored for aluminum components. Methods such as mechanical scraping, abrasive blasting, or ultrasonic vibration are used to remove aluminum deposition materials without the aggressive chemical reactions that would substantially degrade the base aluminum components.
Solution Approach 2:
The patent applies localized mechanical removal methods that target only the deposited material layers while preserving the base aluminum component structure. By controlling the mechanical action to affect only the surface deposition layers and not penetrate into the bulk material, the integrity of the aluminum components is maintained while achieving effective deposition removal.
3Temperature
If high thermal conductivity materials are used for substrate process components to remove thermal energy, then thermal management is improved, but the components are expensive and degraded by chemical cleaning
Solution Approach 1:
The patent replaces chemical cleaning methods with mechanical removal methods for high thermal conductivity components (such as copper or aluminum). This substitution preserves the thermal management functionality of these expensive materials by eliminating chemical degradation while still achieving effective residue removal, thereby extending their service life and justifying their high cost.
Solution Approach 2:
The patent applies protective measures before chemical cleaning processes to prevent degradation of high thermal conductivity components. This may include applying protective coatings, using selective masking, or implementing preventive mechanical removal methods that cushion these expensive components from the degrading effects of chemical cleaners, thereby preserving their thermal performance and extending service life.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Extends the service life of substrate process components by preventing material erosion during recycling, reduces toxic waste generation, and allows for multiple reuse cycles without degrading the components.
Implementation Method 1
machining the substrate process component with a mechanical cutting tool to remove the residue layer
Data Source
AI summary
A method for recycling a substrate process component of a processing chamber is provided. In one example, the recycling process includes retrieving a reference dimension for the substrate process component. The substrate process component includes a side wall having a bottom surface, an outer surface, a pre-defined wall thickness between the bottom surface and the outer surface, and a residue layer. The reference dimension corresponds to the pre-defined wall thickness. The recycling process includes machining the substrate process component with a mechanical cutting tool. The machining includes securing the substrate process component to a work piece holder and passing the mechanical cutting tool across the outer surface in a machining operation controlled by a controller to remove the residue layer. The controller uses the reference dimension to control the machining operation so that the substrate process component has the reference dimension after removal of the residue layer.


