Electronic Component Substrate Concave Wiring Board Integration
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Solution Overview
Problem
Existing electronic components are not adequately reduced in size due to the inability to effectively minimize the height by varying the substrate thickness, leading to insufficient size reduction.
Innovation Solution
The implementation of an electronic component design featuring a substrate with a thick plate portion and a thin plate portion, where the wiring board is positioned in a concave portion between these regions, allowing the wiring board to be integrated without increasing the overall thickness, and using a conductive member to join the wiring board to the electronic device, thereby reducing the component's height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the substrate thickness is varied only to match the connection terminal height, then the height reduction is limited, but the overall component size cannot be sufficiently reduced
Solution Approach 1:
The wiring board is nested within the concave portion formed in the substrate. The substrate has a thicker first portion and a thinner second portion, creating a recessed area where the wiring board is positioned. This nesting arrangement allows the wiring board to be integrated without increasing the overall height of the electronic component, effectively reducing the component size while maintaining all necessary functional elements.
Solution Approach 2:
The substrate thickness is varied in the vertical dimension to create a concave portion, transitioning from a uniform thickness to a non-uniform thickness profile. This dimensional change creates space within the substrate structure itself to accommodate the wiring board, enabling height reduction while integrating additional components without adding external protrusions.
2Length of moving object
If the wiring board is integrated into the substrate structure, then the overall thickness is reduced, but the wiring board must be positioned precisely within the concave portion
Solution Approach 1:
The concave portion is pre-formed in the substrate before the wiring board is installed. By creating the recessed area in advance through substrate thickness variation, the wiring board has a predetermined position and space to be placed, which guides the assembly process and ensures proper positioning without requiring complex real-time alignment procedures.
Solution Approach 2:
The patent employs a conductive member for joining the wiring board to the substrate. This conductive member serves as a simple, effective connection element that facilitates precise positioning and electrical connection during assembly, enabling the wiring board to be securely integrated into the concave portion with appropriate positioning precision.
3Length of moving object
If the substrate is made thinner in the connection region, then the component height is reduced, but the structural strength may be compromised
Solution Approach 1:
The substrate is designed with non-uniform thickness, having a thicker first portion and a thinner second portion. This local quality variation allows the substrate to maintain sufficient structural strength in the thicker regions while creating space for wiring board integration in the thinner region, achieving both height reduction and strength preservation through spatially differentiated design.
Solution Approach 2:
The substrate structure combines regions of different thicknesses to create a composite-like configuration. The thicker first portion provides structural support and strength, while the thinner second portion enables height reduction and accommodates the wiring board, effectively creating a multi-functional integrated structure that balances mechanical properties with size reduction requirements.
Data Source
AI summary
An electronic component includes an electronic device including a substrate, and a wiring board including a conductor unit electrically connected to the electronic device and an insulation unit configured to support the conductor unit. The substrate includes a front surface including a first region, a back surface including a second region, and an end surface connecting the front surface and the back surface. The substrate further includes a first portion located between the first region and the second region and a second portion having a thickness smaller than that of the first portion. The insulation unit of the wiring board is located between a virtual plane surface located between the first region and the second region and the second portion.