Substrate Processing Condition Setting for Stable Etch Windows
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Solution Overview
Problem
Existing substrate processing systems face challenges in achieving stable mass production due to narrow process windows and excessive liquid consumption when deriving processing conditions, leading to unsuitable conditions for mass production.
Innovation Solution
A method and system that utilize a trained model to acquire estimation processing results, display these results through a user-friendly interface, and allow users to select optimal processing conditions based on distribution charts with selectable marks, ensuring accurate and efficient substrate processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a trained model is used to derive processing conditions, then processing precision is improved, but the process window becomes narrow making mass production unstable
Solution Approach 1:
The system dynamically adjusts processing conditions by allowing users to input target values for etch amount and etch uniformity, then automatically determining optimal conditions from multiple candidates. This dynamic adaptation enables the system to maintain precision while accommodating variations in mass production scenarios.
Solution Approach 2:
The system changes multiple processing parameters simultaneously (processing liquid concentration, temperature, supply amount, substrate rotational speed, nozzle scan speed) to find optimal conditions that satisfy both precision requirements and mass production stability. By exploring parameter spaces beyond the narrow trained window, the system discovers alternative condition sets that achieve similar etch profiles with broader process margins.
2Manufacturing precision
If processing conditions are optimized for specific etch profile, then manufacturing precision is improved, but liquid consumption increases significantly
Solution Approach 1:
The system identifies alternative processing conditions that achieve the same etch profile accuracy with reduced liquid consumption. By adjusting parameters such as processing liquid concentration, temperature, and supply amount in combination with substrate rotational speed and nozzle scan speed, the system finds optimal points that minimize liquid usage while maintaining etch precision.
Solution Approach 2:
The system incorporates feedback mechanisms where users can input target etch amounts and uniformity requirements, and the system evaluates multiple candidate conditions to recommend the most efficient option. This feedback loop enables selection of conditions that balance etch profile accuracy with resource efficiency.
3Manufacturing precision
If multiple processing parameters are adjusted to achieve target etch profile, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The system serves multiple functions: it calculates etch profiles, evaluates multiple candidate conditions, ranks options by efficiency, and provides recommendations. This multi-functionality is achieved through integrated processing that combines simulation, optimization, and user interaction interfaces, reducing the need for separate complex control systems.
Solution Approach 2:
The system automatically determines optimal processing conditions by inputting target values and automatically selecting from multiple candidates. This self-service capability reduces the burden on operators to manually adjust multiple parameters, as the system performs the complex optimization work automatically based on user-specified targets.
4Productivity
If processing conditions are derived automatically, then productivity is improved, but ease of operation decreases
Solution Approach 1:
The system provides dynamic control where users can specify target etch amounts and uniformity requirements, and the system adaptively determines optimal conditions. Users can also review multiple candidate conditions and select from ranked options, maintaining flexibility while benefiting from automated analysis.
Solution Approach 2:
The system incorporates feedback loops where user inputs (target etch parameters) guide the automated determination process, and the system outputs multiple candidate conditions with rankings for user review. This feedback mechanism maintains user control and flexibility while leveraging automated computation for efficiency.
Data Source
AI summary
A substrate processing condition setting method includes acquiring, causing, and setting. In the acquiring, a plurality of estimation processing results are acquired by inputting a plurality of processing conditions to a trained model that is subjected to machine training based on a training processing condition and a processing result obtained by processing a substrate under the training processing condition. In the causing, a display section is caused to display an image based on the estimation processing results. In the setting, one processing condition corresponding to one estimation processing result of the estimation processing results is set, as an actual processing condition in substrate processing, based on the image displayed on the display section.