Substrate Structure with Conductive Pillars for Rigid-Flex Integration
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Solution Overview
Problem
Rigid-flexible circuit boards face challenges with complex circuit layouts, high costs, and limited ability to achieve fine line spacing, high-density, thinning, and effective heat dissipation while maintaining high electrical characteristics.
Innovation Solution
A substrate structure comprising a metal carrier, conductive wiring layers, dielectric layers, and conductive pillar layers, where the conductive pillars are electrically connected between the wiring layers, enhancing rigidity, heat dissipation, and electrical performance, and a manufacturing method involving steps to form these layers for improved integration and cost-effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If rigid-flexible circuit board is manufactured by combining printed circuit board with flexible circuit board using lamination procedure, then the circuit board can achieve both rigidity and flexibility, but the manufacturing process becomes complex and costs increase
Solution Approach 1:
The patent combines the rigid support function and flexible circuit function into a single integrated substrate structure. The metal carrier provides rigidity while the conductive wiring layers and dielectric layers provide flexible circuit functionality, eliminating the need for separate rigid and flexible circuit boards and their complex lamination process
Solution Approach 2:
The metal carrier serves multiple functions simultaneously: it provides mechanical support (rigidity), thermal management (heat dissipation), and electrical conductivity (grounding and power distribution). This multi-functionality reduces the need for additional components and simplifies the overall structure
2Quantity of substance
If complex circuit layout is implemented to achieve high-density integration, then more electronic components can be integrated, but the manufacturing precision requirements increase and costs rise
Solution Approach 1:
The patent transitions from planar circuit layout to three-dimensional vertical stacking with multiple conductive wiring layers (first conductive wiring layer, second conductive wiring layer) connected by conductive pillars. This vertical dimension enables higher component integration density without increasing lateral line spacing complexity
3Quantity of substance
If traditional substrate structure is used, then manufacturing is simpler, but heat dissipation capability is insufficient for high-density integration
Solution Approach 1:
The patent uses a composite structure combining metal carrier (high thermal conductivity) with dielectric layers and conductive wiring layers. The metal carrier acts as a heat sink, efficiently conducting heat away from the densely integrated components, while the dielectric layers provide electrical insulation and structural support
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a substrate structure with improved rigidity, heat dissipation, fine line spacing, high-density, and low-cost, high-electrical characteristics, simplifying the manufacturing process and integrating metal carriers for enhanced conductivity and thermal efficiency.
Implementation Method 1
The substrate structure includes a metal carrier... having rigidity and heat dissipation
Implementation Method 2
The first conductive pillar layer is electrically connected to the first conductive wiring layer and the second conductive wiring layer
Data Source
AI summary
A substrate structure and a manufacturing method thereof are provided. The substrate structure comprises a metal carrier, a dielectric material layer, a first conductive wiring layer, a second conductive wiring layer and a conductive pillar layer. The first conductive wiring layer is disposed on a surface of the metal carrier. The dielectric material layer is disposed on a surface of the first conductive wiring layer. The conductive pillar layer is disposed inside the dielectric material layer, and located between the first conductive wiring layer and the second conductive wiring layer. The conductive pillar layer has at least one conductive pillar. The conductive pillar is electrically connected to the first conductive wiring layer and the second conductive wiring layer.