Substrate Structure With Conductive Posts For Cost Reduction
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Solution Overview
Problem
Conventional substrate structures for electronic products face high fabrication costs due to the use of high-end materials for both fine-pitch and non-fine-pitch circuit areas, and alignment errors during the formation of conductive through holes, leading to increased thickness and potential quality issues.
Innovation Solution
A substrate structure is designed with a circuit board fabricated using high-cost insulating material only in the circuit board, and the first insulating layer made of low-cost material, with conductive posts acting as integral conductive through holes, eliminating the need for alignment processes and reducing the number of wiring layers, thereby lowering fabrication costs and thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If high-end materials are used for both fine-pitch and non-fine-pitch circuit areas, then the circuit density and quality are improved, but the fabrication cost is increased
Solution Approach 1:
The patent applies different material qualities to different regions: the circuit board uses high-end insulating material for fine-pitch circuits, while the first insulating layer uses low-cost material for non-fine-pitch areas. This local differentiation maintains circuit density where needed while reducing overall fabrication cost.
2Reliability
If multiple wiring portions are stacked and aligned to form conductive through holes, then the electrical connection between layers is improved, but alignment errors occur and the process complexity increases
Solution Approach 1:
The patent merges the conductive posts and conductive through holes into a single integrated structure. The conductive posts extend continuously from the first circuit layer through the first insulating layer to the second circuit layer, eliminating the need for separate alignment processes between stacked wiring portions and reducing process complexity while maintaining reliable electrical connection.
3Reliability
If multiple wiring portions are stacked to bond with high-end chips, then the electrical connectivity is improved, but the overall thickness is increased
Solution Approach 1:
The patent redistributes the wiring portions in the planar dimension rather than stacking them vertically. The first and second circuit layers are arranged side-by-side with conductive posts providing vertical connections, reducing the need for multiple thick insulating layers and thereby reducing overall substrate thickness while maintaining electrical connectivity.
4Reliability
If conductive through holes are formed by stacking and aligning wiring portions, then the electrical connection is established, but alignment errors adversely affect the quality
Solution Approach 1:
The conductive posts are formed in advance as integral structures extending through the entire thickness of the first insulating layer, before the second circuit layer is formed. This preliminary formation eliminates subsequent alignment operations and prevents alignment errors from affecting the quality of conductive through holes.
Data Source
AI summary
A substrate structure is provided, including: a circuit board having a plurality of wiring layers; a first circuit layer; a plurality of conductive posts disposed on the first circuit layer; a first insulating layer encapsulating the circuit board, the first circuit layer and the conductive posts; and a second circuit layer formed on the first insulating layer and electrically connected to the wiring layers with the second circuit layer electrically connected to the first circuit layer through the conductive posts. According to the present disclosure, fine-pitch circuits are formed in the circuit board, and thus only the circuit board needs a high-cost insulating material, thereby allowing the first insulating layer to be made of a low-cost material to reduce the fabrication cost.