Substrate Conductor Path Covering Dielectric Areas to Prevent Delamination
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Solution Overview
Problem
The existing semiconductor device packages face delamination issues due to separation of metal conductor paths from non-conductive layers, leading to potential failure and reduced performance.
Innovation Solution
A substrate design where conductor paths completely cover the dielectric areas surrounding contact areas, preventing intersections and underetching, thereby enhancing adhesion and reducing the likelihood of delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal conductor paths are formed to connect contact areas, then electrical connectivity is achieved, but delamination occurs between the conductor paths and non-conductive layers
Solution Approach 1:
The patent applies preliminary action by forming a protective layer of the first material over the edges of the non-conductive areas before forming the conductor paths. This pre-formed protective layer prevents delamination from the outset by eliminating the exposed edges that would otherwise be susceptible to separation forces during subsequent processing and operation.
Solution Approach 2:
The patent introduces an intermediary protective layer made of a different material than both the non-conductive areas and the conductor paths. This intermediate layer acts as a mediator that bonds to both the non-conductive areas and the conductor paths, preventing direct delamination between these two components while allowing electrical connectivity to be maintained.
2Reliability
If etching temperatures are increased to decrease delamination probability, then adhesion improves, but processing complexity and energy consumption increase
Solution Approach 1:
The patent changes the material parameter by introducing a protective layer made of a material specifically selected for its adhesion properties to both the non-conductive areas and conductor paths. This material parameter change provides delamination resistance without requiring extreme processing conditions, thereby simplifying the overall processing procedure while maintaining reliability.
3Productivity
If conductor paths are reduced to minimum width to increase current density capability, then space efficiency improves, but neck formation and underetching increase
Solution Approach 1:
The patent applies beforehand cushioning by forming a protective layer over the edges of non-conductive areas before the conductor paths are formed. This protective layer acts as a cushion that prevents underetching and neck formation during subsequent processing steps, allowing conductor paths to be reduced to minimum width without compromising their structural integrity or reliability.
Data Source
AI summary
A substrate for an electronic circuit is provided wherein the substrate comprises a plurality of contact areas (304), a plurality of dielectric areas (307), and a conductor path (301), wherein each of the plurality of contact areas is surrounded by a respective one of the dielectric areas, and wherein at least two of the contact areas are connected with each other by the conductor path. Furthermore, the conductor path is formed at the dielectric area in such a way that it completely covers the dielectric area.