Flexible Substrate Conductor Routing Without Adhesives or Clips
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Solution Overview
Problem
Conductor management in medical devices often requires additional components, hazardous materials, and energy-intensive processes, increasing cost and manufacturing time, and is limited by conductor insulation type and thickness.
Innovation Solution
A method involving a flexible substrate with integral routing features that allows conductors to be securely positioned and managed without additional components or hazardous materials, using cutting devices to form holes for conductor passage, ensuring proper routing and encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire channels are used for conductor management, then conductors can be properly routed and positioned, but additional componentry must be supplied and inserted, increasing cost and manufacturing time
Solution Approach 1:
The patent integrates conductor routing functionality directly into the flexible substrate by forming holes through routing features that are part of the substrate structure itself, rather than using separate wire channel components. This merging eliminates the need for additional componentry while maintaining proper conductor positioning and routing capabilities.
Solution Approach 2:
The patent extracts the conductor management function from separate components and embeds it directly into the flexible substrate structure. The routing features and holes are formed as integral parts of the substrate, removing the need for distinct wire channel components that would otherwise be required for conductor routing.
2Reliability
If adhesives are used for conductor management, then conductors can be secured within the medical device, but additional materials including hazardous carrier fluids are introduced and additional energy or processing is required to cure
Solution Approach 1:
The patent employs the self-service principle by using the flexible substrate's own structural features (routing features with holes) to secure and position conductors. The substrate itself provides the constraint and guidance for conductors through its integrated routing features, eliminating the need for external adhesives or securing materials.
Solution Approach 2:
The patent removes adhesives and hazardous carrier fluids from the conductor management process entirely. Instead of using chemical bonding agents, the solution extracts the securing function and implements it through mechanical constraint provided by the substrate's integrated routing features and holes.
3Reliability
If clips are used for conductor management, then conductors can be positioned, but size limitations apply and additional componentry must be supplied and inserted, increasing cost and manufacturing time
Solution Approach 1:
The patent creates a universal conductor management solution where the flexible substrate with integrated routing features can accommodate conductors of various sizes, insulation types, and thicknesses. The routing features and holes are designed to be adaptable to different conductor configurations, eliminating the size limitations associated with fixed-size clips.
Solution Approach 2:
The patent merges the conductor positioning function into the substrate structure itself, creating a unified system that eliminates the need for separate clip components. This integration allows the substrate to adapt to different conductor sizes and types without requiring additional componentry.
4Reliability
If traditional conductor management methods are used, then conductors can be managed, but manufacturing time and costs increase due to additional components and processing steps
Solution Approach 1:
The patent implements preliminary action by pre-forming the routing features and holes in the flexible substrate during substrate manufacturing, before conductor assembly. This advance preparation eliminates the need for separate conductor routing feature creation steps and reduces assembly time, as conductors can be directly positioned and secured through the pre-formed holes.
Solution Approach 2:
The patent combines multiple manufacturing steps into a single integrated process. The routing features and holes are formed as part of the substrate manufacturing process, and conductor positioning is achieved through the same structural features, eliminating the need for separate component assembly steps and reducing overall manufacturing time.
Data Source
AI summary
In various examples, a method of conductor management within a medical device includes providing a flexible substrate. The flexible substrate includes at least one routing feature. A hole is cut in the at least one routing feature with a cutting device. A conductor is passed through the hole in the at least one routing feature. The routing feature acts to maintain and manage positioning of the conductor within the medical device. The medical device, in some examples, includes a lead, with the conductor connected to an electrode of the lead after being routed through the routing feature.