Substrate Connection Module Structure for Camera Sensor
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Solution Overview
Problem
Current flip chip technologies for camera modules are expensive, have low unit production capacity, and yield control issues, failing to meet the demands of miniaturization and high-density packaging in electronic devices.
Innovation Solution
A substrate connection type module structure integrating a substrate, lens holder, and image sensor with a through hole structure and contact pads, where the substrate and chip are at the same level, allowing for a smaller module height, improved yield, and enhanced thermal performance, using a combination of printed and flexible circuit boards with adhesion layers for heat dissipation and anti-EMI materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If flip chip technology is used for camera modules, then module height is reduced, but manufacturing cost increases and productivity decreases
Solution Approach 1:
The patent inverts the conventional flip chip attachment approach by using wire bonding instead of bump bonding. The chip is mounted in a normal orientation (not flipped) and connected via wires, which resolves the contradiction by enabling standard manufacturing processes that maintain high productivity while achieving compact module height through optimized stacking and integration
2Length of stationary object
If flip chip technology is used for camera modules, then module height is reduced, but manufacturing cost increases
Solution Approach 1:
The patent employs wire bonding technology which uses inexpensive wire materials (such as aluminum or copper wires) compared to the expensive solder bump materials and specialized equipment required for flip chip technology. This principle resolves the contradiction by substituting costly flip chip components with cheaper wire bonding materials while maintaining the compact module height through efficient space utilization
3Ease of manufacture
If traditional package techniques are used, then manufacturing is easier, but device size cannot be reduced
Solution Approach 1:
The patent merges multiple functions into the substrate structure, including mechanical support, electrical connection pathways, and thermal management features. By integrating these functions into a single substrate that uses standard manufacturing processes, the patent achieves both ease of manufacture (through familiar techniques) and reduced device size (through functional integration and eliminated separate components)
Solution Approach 2:
The patent transitions from planar packaging to a three-dimensional stacked architecture where components are arranged vertically above the substrate. This dimensional change enables compact device size by utilizing vertical space while maintaining ease of manufacture through standard wire bonding and assembly processes that don't require complex advanced packaging equipment
Data Source
AI summary
The present invention provides a substrate connection type module structure comprising a substrate with a through hole structure and a first contact pad. A chip is configured on the through hole structure of the substrate, with a second contact pad and a sensing area. The first contact pad is coupled to the second contact pad via a wire. A second substrate is electrically connected to the first substrate. The second substrate and the chip are located at the same layer. A lens holder is disposed on the substrate, and a lens is located on the top of the lens holder. A transparent material is disposed within the lens holder. The lens is substantially aligning to the transparent material and the sensing area.