Substrate Connector With Columnar Conductors For High Routing Density

The interposer is divided into multiple layers (first interposer layer, second interposer layer, third interposer layer) with different functions. The first layer provides mechanical support with larger pitch holes, the second layer provides electrical interconnections with columnar conductors, and the third layer provides additional routing. This segmentation allows each layer to be optimized independently, enabling higher routing density without being constrained by the 300 micron pitch limitation of traditional single-layer interposers.

Multiple interposer layers are nested within each other, with the first interposer layer containing support structures, the second layer containing columnar conductors for electrical interconnection, and the third layer providing additional routing paths. This nested multi-layer structure enables complex three-dimensional electrical interconnections between stacked integrated circuit dies while maintaining alignment precision through the hierarchical organization of conductive elements across different layers.

The patent transitions from a two-dimensional arrangement of connection terminals to a three-dimensional multi-layer structure. Columnar conductors extend vertically through the interposer layers, allowing electrical connections to be made in the vertical dimension rather than only in the horizontal plane. This dimensional change enables higher routing density by stacking connection paths vertically while maintaining acceptable alignment tolerances, as the vertical alignment can be controlled through precise layer thickness control and conductor positioning.