Substrate Contact Elements Reducing Particle Generation
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Solution Overview
Problem
In semiconductor processing, contaminants adhere to the backside of substrates during handling, leading to particle generation and reduced device performance, despite conventional solutions that reduce contact area between substrates and handling devices.
Innovation Solution
The use of substrate contact elements formed from materials with a hardness less than or equal to silicon, low adhesion, high static friction to prevent sliding, and surface roughness less than 10 Ra, which are also electrically conductive, such as aluminum oxide, silicon nitride, or stainless steel, to minimize particle generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If contact area between substrate and handling devices is reduced, then particle generation is mitigated, but large numbers of particles are still generated even with smallest contact areas
Solution Approach 1:
The patent changes the material parameters of the contact elements, specifically using materials with hardness less than or equal to silicon (such as aluminum oxide, silicon nitride, or conductive plastics), low adhesion properties, and controlled surface roughness (less than or equal to 10 Ra). These parameter changes allow the contact elements to minimize particle generation while maintaining reliable substrate handling, resolving the contradiction between reducing particle generation and ensuring substrate contamination control.
Solution Approach 2:
The patent employs composite material properties in the contact elements, combining electrical conductivity with low hardness (less than or equal to silicon), low adhesion, and controlled surface roughness. This composite approach allows the contact elements to simultaneously prevent particle generation, maintain electrical connectivity for substrate positioning, and reduce contamination, thereby resolving the technical contradiction.
2Strength
If material hardness is increased to prevent scratching and abrasion, then resistance to scratching improves, but particle generation increases
Solution Approach 1:
The patent inverts the conventional approach by using materials with hardness less than or equal to silicon rather than harder materials. This parameter change prevents particle generation through abrasion while the low adhesion and controlled surface roughness properties compensate by preventing substrate sliding and maintaining handling stability, thus resolving the contradiction between scratch resistance and particle generation.
3Force
If coefficient of friction is increased to prevent substrate sliding, then sliding prevention improves, but particle generation increases
Solution Approach 1:
The patent uses materials with optimized surface properties including controlled surface roughness (less than or equal to 10 Ra) and low adhesion, combined with appropriate hardness. This combination provides sufficient static friction to prevent substrate sliding during handling while minimizing particle generation through abrasion, as the surface properties are tuned to reduce friction-induced particulates while maintaining grip on the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces contamination and particle generation during substrate handling and processing, preventing contaminants from reaching the front-side of the substrate and minimizing yield loss and device performance issues.
Implementation Method 1
having a coefficient of static friction large enough to prevent sliding
Data Source
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Figure 3
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AI summary
Embodiments of apparatus for supporting a substrate are disclosed herein. In some embodiments, an apparatus for supporting a substrate includes: a support surface; and a plurality of substrate contact elements protruding from the support surface, wherein the plurality of substrate contact elements are formed of a material having a hardness less than or equal to a hardness of silicon, having a low adhesion, having a coefficient of static friction large enough to prevent sliding, having a surface roughness less than or equal to 10 Ra, and that is electrically conductive.