Substrate Container Purification for Surface and Airborne Contaminants
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Solution Overview
Problem
Current techniques for purifying semiconductor substrate containers are ineffective in removing contaminants that are adsorbed, deposited, or residual at the surface of the container interior, leading to potential defects in microelectronic devices.
Innovation Solution
A purification system comprising a contaminant removal device, a sensor, and a control system that measures and compares the concentration of airborne molecular contaminants to a criteria concentration, effectively removing contaminants from the gaseous atmosphere and surface of the substrate container.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a purge step is used to replace the gaseous atmosphere in a substrate container, then the concentration of airborne molecular contaminants in the gaseous atmosphere is reduced, but contaminants that are adsorbed, deposited, or residual at the surface of the container interior are not effectively removed
Solution Approach 1:
The system changes the physical-chemical parameters of the gaseous atmosphere by controlling temperature, humidity, and gas composition to facilitate the desorption and removal of contaminants from surfaces. By adjusting these parameters, the system transforms the state of contaminants from adsorbed/deposited to gaseous phase, enabling their effective removal through the purification apparatus.
Solution Approach 2:
The purification apparatus introduces strong oxidizing agents or ozone into the gaseous atmosphere to chemically react with and decompose organic contaminants on surfaces. This accelerated oxidation process breaks down contaminant molecules, converting them into volatile products that can be removed from the container interior, thereby addressing the limitation of conventional purge steps.
2Productivity
If conventional purge techniques are used, then the gaseous atmosphere is replaced with clean dry gas, but the purification process does not achieve sufficiently low contaminant levels for high-precision microelectronic device manufacturing
Solution Approach 1:
The system implements continuous circulation and purification of the gaseous atmosphere rather than simple batch replacement. The purification apparatus continuously processes the gas phase contaminants and maintains low contaminant levels throughout the container interior, ensuring sustained manufacturing precision without compromising productivity.
Solution Approach 2:
The system introduces intermediary substances such as purified carrier gases or chemical reactants that mediate between the contaminants and the purification process. These intermediaries facilitate the transformation and removal of contaminants while maintaining the integrity of the microelectronic devices, achieving both high productivity and manufacturing precision.
3Reliability
If a thorough purification process is performed to remove all types of contaminants, then the purity of the substrate container is improved, but the process time and complexity increase
Solution Approach 1:
The purification apparatus is designed with multi-functional capabilities that allow it to perform multiple purification tasks using a single integrated system. The device can simultaneously handle gaseous atmosphere replacement, surface contaminant removal, and chemical decomposition processes, thereby achieving high container purity without proportionally increasing process complexity.
Solution Approach 2:
The system incorporates self-regulating mechanisms and automated control that allow the purification process to adjust itself based on real-time monitoring of contaminant levels. This self-service capability reduces the need for complex external control systems while maintaining high purity standards, effectively balancing reliability and device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves a significantly lower concentration of airborne molecular contaminants, reducing the risk of defects in microelectronic devices and improving the overall purity of the substrate container.
Implementation Method 1
a contaminant removal device in fluid communication with the interior... causing the gas to contact the contaminant removal device to remove an airborne molecular contaminant from the gas
Data Source
AI summary
Described are methods and apparatus that are useful to for purifying a substrate container that is used to hold, store, or transport semiconductor substrates.