Substrate Processing Controller Optimizes Module Combinations
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Solution Overview
Problem
Existing substrate processing systems for semiconductor manufacturing face challenges in achieving uniform pattern attributes due to individual differences among modules and chambers, leading to uneven line width, sidewall angle, and etching bias, which cannot be fully corrected by individual module or chamber adjustments.
Innovation Solution
A substrate processing system that includes a controller to measure and calculate correction values for modules and chambers based on pattern attribute measurements, determining optimal combinations to ensure uniform pattern attributes across substrates, thereby increasing productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple modules and chambers are used to process substrates in parallel, then productivity is improved, but pattern attribute uniformity deteriorates due to individual differences among modules and chambers
Solution Approach 1:
The patent applies parameter changes by adjusting correction values for each module and chamber based on measured pattern attributes. The system calculates individual correction values for heating processes in each module and etching processes in each chamber, then uses these corrected parameters to process substrates, thereby compensating for individual differences and achieving uniform pattern attributes across multiple processing units
Solution Approach 2:
The patent implements feedback by measuring pattern attributes (line width, sidewall angle, etching bias) from substrates processed by each module and chamber, then using these measurement results to calculate and adjust correction values. This closed-loop feedback system continuously optimizes processing parameters to maintain uniformity while utilizing multiple parallel processing units
2Manufacturing precision
If individual correction values are set for each module and chamber, then pattern attribute uniformity is improved, but device complexity increases
Solution Approach 1:
The patent applies universality by using a single pattern forming apparatus that integrates multiple modules for different processes (coating, developing, heating) and multiple chambers for etching. The control unit centrally manages correction values for all modules and chambers, providing a universal platform that handles both resist pattern formation and etching processes with unified correction value calculation and application
Data Source
AI summary
A substrate processing system includes a resist pattern forming apparatus including modules each configured to perform a predetermined process on a substrate with an underlying film formed thereon, an etched pattern forming apparatus including chambers each configured to perform patterning of the underlying film by use of a resist pattern as a mask, and examination devices configured to perform measurement and examination of a pattern attribute rendered on a substrate after a process in the resist pattern forming apparatus and after a process in the etched pattern forming apparatus. A controller is preset to utilize measurement results and transfer data to calculate correction value ranges respectively settable in the modules and the chambers and to determine combinations of the modules and the chambers such that corrections made within the correction value ranges cause a pattern attribute to approximate a predetermined value for each of the substrates.