Substrate Conveyance Control for Warpage and Stability Trade-Offs

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Solution Overview

Problem

Conventional substrate processing techniques lack the ability to automatically determine optimal drive parameters, substrate chucking pressure, and conveying path for each process, especially when handling substrates with warpage, low reverse surface flatness, or chemical coatings, which affects productivity and stability.

Innovation Solution

A substrate processing apparatus that determines a conveying procedure based on control information accumulated during the processing of substrates, allowing it to select between productivity-oriented and stability-oriented procedures depending on factors like chucking pressure, chucking time, and alignment errors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Extent of automation

If conventional substrate conveying techniques are used, then substrate conveyance can be performed, but automatic determination of optimal drive parameters and conveying procedures for each process is not achieved

Engineering Contradiction:

Improveautomatic determination of conveying procedureVSAvoidconveying mechanism control system

Core Design Contradiction:

Extent of automationVSDevice complexity

Solution Approach 1:

The system pre-stores multiple conveying procedures (first conveying procedure for productivity, second conveying procedure for stability) in advance. Based on substrate type identification and process information, the appropriate pre-stored procedure is automatically selected and executed, eliminating the need for real-time complex calculations while achieving automated optimization.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The conveying system dynamically switches between different conveying procedures based on real-time substrate conditions and process requirements. The drive parameters, chucking pressures, and conveying paths are adaptively adjusted by selecting from pre-defined procedure sets, enabling the system to respond flexibly to varying substrate types without increasing control complexity.

Inventive Principle:

Principle #15Dynamics

2Productivity

If productivity-oriented conveying is used, then substrate conveyance speed is improved, but conveyance stability may deteriorate

Engineering Contradiction:

Improvesubstrate conveyance speedVSAvoidconveyance stability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The conveying procedures are segmented into distinct types: first conveying procedures optimized for productivity with faster speeds, and second conveying procedures optimized for stability with more conservative parameters. This segmentation allows the system to select the appropriate procedure based on substrate conditions, achieving both high productivity when possible and high stability when needed.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different conveying procedures utilize different drive parameters, chucking pressures, and conveying speeds. By changing these parameters based on substrate type and process requirements, the system can optimize for either productivity or stability as needed, resolving the contradiction between speed and stability.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If stability-oriented conveying is used, then conveyance reliability is improved, but productivity decreases

Engineering Contradiction:

Improveconveyance stabilityVSAvoidsubstrate conveyance speed

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Inventive Principle:

Principle #35Parameter changes

4Reliability

If substrate chucking pressure is increased to handle substrates with warpage or low reverse surface flatness, then substrate holding stability is improved, but substrate damage risk increases

Engineering Contradiction:

Improvesubstrate holding stabilityVSAvoidsubstrate damage

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The system applies different chucking pressures at different locations on the substrate based on identified warpage patterns or reverse surface conditions. By locally adjusting the holding force rather than uniformly increasing pressure across the entire substrate, the system achieves stable holding of problematic substrates while minimizing the risk of damage.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The chucking pressure parameters are dynamically adjusted based on substrate type identification. For substrates with warpage or low reverse surface flatness, the system modifies pressure distribution and magnitude within safe limits, achieving stable holding without exceeding damage thresholds through optimized parameter selection.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentEP3709084B1Substrate processing apparatus and article manufacturing method

Publication Date: 2025.05.21 CANON KK

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AI summary

The present invention provides a substrate processing apparatus that processes a substrate, the apparatus including a stage configured to hold and move the substrate, a conveying unit configured to hold and convey the substrate between conveying unit and the stage, an accumulation unit configured to accumulate control information concerning the stage and the conveying unit which is generated by processing the substrate, and a determination unit configured to determine a conveying procedure when conveying the substrate between the stage and the conveying unit by selecting one of a plurality of conveying procedures which can be set for the stage and the conveying unit based on control information accumulated in the accumulation unit.