Substrate Support Coolant Switching to Prevent Thermal Stress
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Solution Overview
Problem
Existing plasma processing chambers require manual hardware changes to switch between hot and cool operations, which is time-consuming, and using deionized water as a coolant can cause thermal stress and potential rupture of hoses due to flash vaporization.
Innovation Solution
An automated temperature-controlled substrate support system with a cooling apparatus featuring a heat exchanger, manifold assembly, three-way valve, and controller to switch between different coolants, allowing for automatic operation without hardware changes and preventing thermal stress by using a second coolant like nitrogen or argon.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If manual hardware changes are made to switch between hot and cool operations, then the substrate support can be operated at different temperatures, but the process becomes time-consuming and reduces throughput
Solution Approach 1:
The system dynamically switches between hot and cool operation modes using automated control. A controller automatically activates either heating devices (resistive heaters) or cooling devices (coolant channels with cryogenic coolant) based on the desired substrate temperature, eliminating manual hardware changes and enabling rapid temperature transitions to maintain high throughput
Solution Approach 2:
The system changes the thermal parameter of the substrate support by controlling the flow of cryogenic coolant through coolant channels. The controller adjusts coolant flow rate and temperature to achieve desired substrate temperatures, allowing flexible temperature control without physical hardware modifications
2Temperature
If deionized water is used to cool a hot substrate support, then cooling effectiveness is improved, but thermal stress causes the substrate support to crack and flash vaporization can rupture feed hoses
Solution Approach 1:
The system uses cryogenic coolant (such as liquid nitrogen or refrigerated gas) instead of deionized water to cool the substrate support. This inert coolant prevents thermal stress cracking and flash vaporization issues associated with water, while effectively cooling the substrate support to desired temperatures without compromising structural integrity
Solution Approach 2:
The system employs a disposable or replaceable coolant system where cryogenic coolant is continuously supplied and vented. The coolant channels are designed to handle the extreme temperature differentials without permanent damage, allowing the coolant to be rapidly exchanged or replenished without affecting the substrate support structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and safe switching between hot and cool operations without manual hardware changes, preventing thermal stress and hose rupture, thereby improving processing chamber throughput and safety.
Implementation Method 1
a cooling apparatus for use with a substrate support of a processing chamber can comprise a heat exchanger
Implementation Method 2
a first three-way valve connected between the first output of the manifold assembly and the substrate support and connected between the gas input and the substrate support
Implementation Method 3
a controller configured to control supplying one of the first coolant or the second coolant during operation
Data Source
AI summary
Methods and apparatus for processing a substrate are provided herein. For example, a cooling apparatus for use with a substrate support of a processing chamber comprises a heat exchanger, a manifold assembly comprising a first input configured to connect to an output of the heat exchanger, a second input configured to connect to a first coolant supply configured to supply a first coolant, a first output configured to connect to the substrate support of the processing chamber, and a second output configured to connect to an input of the heat exchanger, a gas input configured to connect to a second coolant supply that is configured to supply a second coolant that is different from the first coolant to the substrate support, a first three-way valve connected between the first output of the manifold assembly and the substrate support and connected between the gas input and the substrate support, and a controller configured to control supplying one of the first coolant or the second coolant during operation.