Substrate Support Coating via Coolant Temperature Control
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Solution Overview
Problem
The existing methods for coating substrate support assemblies in semiconductor processing chambers are limited by the degradation of bonding materials at elevated temperatures, leading to erosion and contamination issues, which increase costs and processing defects due to the need for frequent replacement of the substrate support assemblies.
Innovation Solution
A method of coating the substrate support assemblies using a coolant to maintain a temperature below 150°C, preventing damage to the bonding materials, and applying a protective layer composed of a Group IIIB metal alloy or rare earth ceramic to protect the components from corrosive gases, allowing for reuse without de-bonding and re-bonding processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a coating process is performed at elevated temperature to protect the substrate support assembly, then the protective coating effectiveness is improved, but the bonding materials degrade, outgas or change chemically or mechanically
Solution Approach 1:
The patent changes the temperature parameter from conventional elevated temperatures to a reduced temperature range (room temperature to 150°C). This parameter change allows the protective coating to be applied without degrading the bonding materials, thus resolving the contradiction between coating effectiveness and bonding material stability.
Solution Approach 2:
The patent introduces a temperature control system with coolant flow as an intermediary mechanism. This mediator maintains the substrate support assembly within the safe temperature range during coating, enabling both effective coating application and bonding material preservation simultaneously.
2Reliability
If the substrate support assembly is replaced frequently due to erosion, then processing reliability is maintained, but material cost and machine downtime increase
Solution Approach 1:
The patent applies protective coating as a preliminary action to prevent erosion before it occurs. By coating the substrate support assembly with erosion-resistant material, the assembly can be reused for many more process cycles, eliminating the need for frequent replacements and reducing machine downtime.
Solution Approach 2:
Instead of discarding eroded substrate support assemblies, the patent recovers them by applying protective coating during refurbishment processes. This extends the service life of the assemblies and reduces both material cost and machine downtime associated with frequent replacements.
3Productivity
If the substrate support assembly is exposed to highly corrosive species during plasma processing, then in-situ chamber cleaning is achieved, but erosion induced variations in electrical properties occur
Solution Approach 1:
The patent applies protective coating as a preliminary anti-action measure to protect the substrate support assembly from the harmful effects of highly corrosive species. This protective layer allows the assembly to withstand chamber cleaning processes and plasma exposure without suffering erosion that would vary electrical properties.
Solution Approach 2:
The patent uses highly corrosive species beneficially for in-situ chamber cleaning while the protective coating prevents these same species from eroding the substrate support assembly. The harmful corrosive action is directed at the chamber walls rather than the chuck, converting a potential harm into a useful cleaning function.
4Strength
If bonding materials are used to couple components together, then assembly strength is achieved, but the bonding materials limit the refurbishment process at elevated temperatures
Solution Approach 1:
The patent changes the temperature parameter of the refurbishment process to remain below the degradation threshold of bonding materials (room temperature to 150°C). This parameter change enables refurbishment activities such as protective coating application without compromising bonding material integrity, thus increasing process flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach extends the lifespan of substrate support assemblies, reduces refurbishment costs, and minimizes contamination by maintaining the integrity of the bonding materials and ensuring uniform coating and planarity, thereby enhancing processing reliability and efficiency.
Implementation Method 1
flowing a coolant through channels formed in a base of the substrate support assembly
Implementation Method 2
a protective coating material that is resistant to attack by the plasma and/or process gases
Data Source
AI summary
Embodiments of the invention may generally provide a method and apparatus that is used to prepare new and used substrate support assemblies for use in typical semiconductor processing environments. Embodiments of the present invention generally relate to a method of coating a new substrate support assembly or a used substrate support assembly that is being refurbished. The deposited coating may include a surface enhancement and/or protective material that is configured to protect one or more of the components exposed to the processing environment during a semiconductor process. The substrate support assembly may be coated with a protective material and during the coating process, the substrate support assembly is maintained at a temperature that is less than or equal to 150° C. by flowing a coolant through channels formed in a base of the substrate support assembly.