Substrate Processing Cooling Layout for Rotation Body Condensation
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Solution Overview
Problem
The existing freeze cleaning method for substrates results in condensation on the rotation body, leading to droplet formation that can contaminate the substrate, as cooling gas supplied from the substrate surface side cools the rotation body and ambient atmosphere, causing condensation and droplet formation on the opposite surface.
Innovation Solution
A substrate processing apparatus and method that maintains a space between the substrate and the rotation body, supplies cooling gas from the opposite side to prevent rotation body cooling, and includes a detector and remover to eliminate droplets on the rotation body surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If cooling gas is supplied from the surface side opposite the processed surface to prevent water film freezing from surface side, then foreign substance separation is improved, but the rotation body is cooled causing condensation and droplet formation on the rotation body surface
Solution Approach 1:
The patent divides the cooling gas supply system into two separate nozzles: one positioned at the processed surface side and another at the opposite surface side. This segmentation allows independent control of cooling gas flow to prevent water film freezing while avoiding excessive cooling of the rotation body that causes condensation.
Solution Approach 2:
The patent applies local quality by positioning cooling gas supply nozzles at specific locations (processed surface side and opposite surface side) to provide targeted cooling only where needed for water film freezing prevention, rather than uniform cooling of the entire rotation body, thus avoiding condensation on the rotation body surface.
2Manufacturing precision
If cooling gas is supplied to freeze water film on substrate, then foreign substance cleaning is improved, but condensation occurs on rotation body surface facing substrate
Solution Approach 1:
Instead of supplying cooling gas only from the processed surface side (conventional approach), the patent inverts the approach by also supplying cooling gas from the opposite surface side. This inverted cooling approach prevents water film freezing from the surface side while the controlled cooling prevents excessive temperature drop on the rotation body, avoiding condensation.
Solution Approach 2:
The patent introduces an intermediary mechanism (detection device and control system) that monitors the cooling process and adjusts cooling gas supply accordingly. This intermediary control ensures optimal cooling for water film freezing while preventing over-cooling that would cause condensation on the rotation body surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents droplet contamination of substrates by effectively removing droplets from the rotation body surface, improving substrate cleanliness and efficiency by minimizing droplet formation and ensuring accurate detection and removal.
Implementation Method 1
supplying cooling gas in space between the substrate and the placement portion and freezing the liquid supplied on the processed surface
Implementation Method 2
AS the rotation body is cooled and temperature thereof is decreased, ambient atmosphere is cooled by the cooled rotation body, causing condensation on a surface of the rotation body facing the substrate
Data Source
AI summary
The substrate processing apparatus 1 of the present embodiment includes the rotation body 10 including the placement portion 13 to place the substrate W with the processed surface so that the space is maintained between the surface of the rotation body 10 facing the substrate W and the surface of the substrate W opposite the processed surface; the rotation driver 16 that rotates the rotation body 10, the liquid suppliers 30 and 40 that supply the processing liquid L1 and L2 on the processed surface of the substrate W, the cooler 20 that supplies the cooling gas G to the space between the substrate W and the placement portion 13, and the remover 90 that removes the droplet D on the surface of the rotation body facing the substrate W.