Substrate Cooling Gas Control for Stable ALD and ALE Processing
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Solution Overview
Problem
Current substrate cooling methods, such as air cooling and water cooling, are inefficient in maintaining consistent substrate temperature during semiconductor manufacturing processes like ALD and ALE, leading to overheating and process instability.
Innovation Solution
A substrate treatment method and apparatus that utilize a direct cooling gas supply through gas discharge holes in the support member to rapidly cool the substrate, allowing for non-contact cooling and adjustable cooling efficiency, thereby maintaining the substrate temperature within a predetermined range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If air cooling method is used to cool the substrate, then the cooling structure is simple, but the cooling speed is slow and cooling efficiency is low
Solution Approach 1:
The patent applies pneumatic cooling by introducing cooling gas (such as nitrogen or helium) through nozzles positioned near the substrate. This gas flow directly contacts the substrate surface to remove heat, achieving rapid cooling without complex mechanical cooling structures. The cooling gas is supplied through a gas supply unit with controllable flow rate and pressure, enabling efficient heat dissipation while maintaining structural simplicity.
2Speed
If water cooling method is used to cool the substrate, then the cooling efficiency is higher than air cooling, but the substrate can be cooled only when seated on a support member with cooling flow path
Solution Approach 1:
The patent uses pneumatic cooling with gas flow that can cool the substrate regardless of its position or support configuration. The cooling gas is delivered through nozzles that can be positioned to cool the substrate surface directly, eliminating the requirement for the substrate to be seated on a support member with embedded cooling channels. This provides versatile cooling capability applicable to various substrate handling scenarios.
3Speed
If water cooling method is used, then cooling efficiency is higher, but cooling temperature is limited by the use temperature range of cooling fluid
Solution Approach 1:
The patent employs cooling gases such as nitrogen or helium that can operate across a wide temperature range. By changing the cooling medium from liquid water to these gases, the system achieves both high cooling efficiency and the ability to maintain lower substrate temperatures. The flow rate and pressure of the cooling gas can be adjusted to control the cooling temperature, providing flexibility that overcomes the temperature limitations of water cooling.
4Manufacturing precision
If repeated heating and cooling processes are performed, then the desired pattern is formed through multiple treatment steps, but the substrate temperature and treatment space temperature increase causing process instability
Solution Approach 1:
The patent implements a cooling system that operates throughout the treatment chamber, supplying cooling gas to maintain substrate temperature during repeated heating and cooling processes. This continuous cooling capability prevents temperature accumulation in the treatment space, ensuring that each treatment cycle starts from a consistent temperature baseline, thereby maintaining process stability and reproducibility.
Solution Approach 2:
The patent incorporates temperature monitoring and control mechanisms that detect substrate temperature changes during repeated treatment processes. Based on this feedback, the cooling gas flow rate is adjusted to maintain the substrate temperature within the desired range, preventing temperature drift and ensuring consistent process conditions across multiple cycles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances cooling speed and efficiency, preventing overheating and maintaining consistent process conditions, reducing process time, and minimizing substrate damage, ensuring process stability and reproducibility.
Implementation Method 1
a cooling process in which the substrate is cooled by supplying a cooling gas to a lower surface of the substrate
Implementation Method 2
a heating process in which a surface of a substrate is heated
Data Source
AI summary
Proposed are a substrate treatment method and a substrate treatment apparatus that are capable of adjusting cooling efficiency for a substrate. According to an embodiment of the present disclosure, there may be provided the substrate treatment method including a heating process in which a surface of the substrate is heated and a cooling process in which the substrate is cooled by supplying a cooling gas to a lower surface of the substrate. Furthermore, the cooling process includes a cooling condition controlling process in which a cooling condition is controlled.