Substrate Cooling Gas Curtain Blocks Radiant Heat
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Solution Overview
Problem
In semiconductor device manufacturing, substrates held in a substrate holder experience prolonged cooling times due to radiant heat from nearby components, delaying transfer operations.
Innovation Solution
A cooling method involving a first cooling step where gas is supplied to the substrate holder at a reference position, followed by a stopping step to halt gas supply, and a second cooling step where the substrate is cooled at the lower portion of the holder, utilizing a cooling gas nozzle system to form a gas curtain and block radiant heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the substrate is held in the lower portion of the substrate holder for cooling, then the cooling process can be performed, but the substrate is reheated by radiant heat from components in the vicinity, causing the cooling time to be lengthened
Solution Approach 1:
A gas curtain is introduced as an intermediary substance between the substrate and the radiant heat sources. The gas flows in the direction from the upper surface toward the lower surface of the substrate, creating a thermal barrier that blocks radiant heat from reaching the substrate, thereby preventing reheating during the cooling process
Solution Approach 2:
The invention utilizes gas flow dynamics to create a protective curtain around the substrate. By controlling the gas flow rate and direction, a pneumatic barrier is formed that physically intercepts radiant heat paths, allowing the substrate to cool efficiently without reheat interference
2Temperature
If the substrate is held in the lower portion of the substrate holder, then cooling can be performed, but the transfer operation is delayed due to prolonged cooling time
Solution Approach 1:
The gas curtain acts as a mediating element that enables faster cooling by preventing radiant heat interference. This allows the substrate to reach the required temperature more quickly, thereby enabling timely transfer operations and improving overall productivity
Solution Approach 2:
The gas curtain is established before and during the cooling process to preemptively block radiant heat paths. This preliminary protective action ensures that cooling proceeds without interruption or reheat, maintaining efficient transfer operation scheduling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly shortens the cooling time of substrates, allowing for timely transfer without overheating, thereby enhancing operational efficiency in semiconductor device manufacturing.
Implementation Method 1
a first cooling step of cooling the substrate by supplying a gas toward the substrate holder disposed at a predetermined reference position
Implementation Method 2
cooling the substrate held in a lower portion of the substrate holder
Implementation Method 3
the substrate may be reheated by radiant heat from components in the vicinity of the substrate
Data Source
AI summary
A cooling method is a method of cooling a processed substrate in a state of being held by a substrate holder, the method including: a first cooling step of cooling the substrate by supplying a gas toward the substrate holder disposed at a reference position; a stopping step of stopping supply of the gas; and a second cooling step of cooling the processed substrate held in a lower portion of the substrate holder.