Substrate Cooling Plate Layout for Uniform Cooling and Leak Control
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Solution Overview
Problem
Conventional substrate cooling processes in semiconductor manufacturing are inefficient due to non-uniform cooling, substrate warping, and frequent coolant leaks, leading to bottlenecks in throughput.
Innovation Solution
A cooling apparatus with an array of embedded substrate support members and a conduit for coolant, preventing leaks, combined with a substrate transfer system using an indexer and gate valves to optimize substrate handling and cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional cooling plates with cutouts are used for substrate cooling, then substrate access for lift pins is enabled, but cooling uniformity deteriorates and cooling time increases
Solution Approach 1:
The cooling plate surface is segmented into multiple zones with distributed cooling channels instead of a single centralized channel. This segmentation allows uniform heat dissipation across the entire substrate surface without requiring cutouts, as each segment independently contributes to overall cooling uniformity.
Solution Approach 2:
The cooling channels are nested within the substrate support structure itself, with channels integrated into the support members that contact the substrate. This nesting eliminates the need for separate cutouts while maintaining both substrate accessibility and cooling uniformity through the integrated design.
2Ease of manufacture
If conventional bolted cooling plates are used, then structural assembly is simplified, but coolant leaks occur frequently requiring repairs
Solution Approach 1:
A flexible sealing membrane is introduced between the cooling plate and substrate support structure. This thin film creates a leak-proof barrier that conforms to surface irregularities, preventing coolant leaks while maintaining the simple bolted assembly structure. The membrane can be easily replaced if damaged, maintaining ease of manufacture while improving reliability.
Solution Approach 2:
The cooling plate assembly uses composite construction combining rigid structural components with flexible sealing materials. This composite approach maintains the simplicity of bolted assembly while the flexible sealing layer prevents coolant leaks, resolving the contradiction between assembly ease and leak prevention.
3Temperature
If substrates are cooled after high-temperature processing, then substrate temperature is reduced for post-processing, but throughput is reduced due to cooling time
Solution Approach 1:
Cooling channels are positioned to contact the substrate immediately after it exits the high-temperature processing chamber, initiating cooling at the earliest possible moment. This preliminary action reduces the time the substrate remains hot, thereby increasing throughput while still achieving the required temperature reduction for post-processing operations.
Solution Approach 2:
The cooling system maintains continuous coolant flow and sustained thermal contact with the substrate throughout the cooling process, eliminating idle time and ensuring uninterrupted heat removal. This continuous action maximizes cooling efficiency, reducing total cooling time and increasing overall throughput while maintaining effective temperature reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling uniformity, reduces substrate warping, and minimizes downtime by improving coolant management and scheduling, thereby increasing overall processing throughput.
Implementation Method 1
a cooling plate comprising a top surface having an array of embedded substrate support members protruding therefrom. The cooling plate may include a channel disposed in an underside portion of the cooling plate. The channel may include a conduit embedded in the channel comprising a coolant inlet at a first end and a coolant outlet at a second end. In an example, a viscous thermally conductive material may be disposed in the channel and thermally coupled to an interior surface of the channel and an exterior surface of the conduit.
Data Source
AI summary
A substrate cooling apparatus includes a cooling plate with a top surface including an array of embedded substrate support members protruding therefrom. A channel is disposed in an underside portion of the cooling plate, the conduit is embedded in the channel, a conduit comprising a coolant inlet at a first end and a coolant outlet at a second end, and a viscous thermally conductive material is disposed in the channel and is thermally coupled to an interior surface of the channel and an exterior surface of the conduit. One or more open recesses are disposed in a top surface of the cooling plate extending inward from a perimeter of the cooling plate toward a center point of the cooling plate, the open recesses disposed circumferentially on diametrically opposite sides of the cooling plate wherein the open recesses are sized to receive a corresponding substrate handling member of an indexer. Substrate transfer systems, cooling plate arrangements, and substrate transfer methods are also described.