Substrate Cooling Nozzle Dispersion for Uniform Freeze Cleaning
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Solution Overview
Problem
Existing substrate treatment devices face challenges in maintaining uniform temperature distribution across the substrate surface during freeze cleaning, leading to inconsistent contaminant removal rates due to direct cooling gas supply to the back surface, which can cause over-cooling of the central region and inadequate cooling of the outer perimeter.
Innovation Solution
The substrate treatment device incorporates a dispersion part with a dispersion plate located at the discharge side of the cooling nozzle, which alters the flow direction of the cooling gas, reducing heat loss and ensuring a more uniform temperature distribution by supplying the cooling gas to the back surface via a radially-enlarged portion and a hole in the dispersion plate, thereby preventing over-cooling of the central region and enhancing contaminant removal across the entire substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the cooling gas is supplied directly to the back surface of the substrate, then the cooling effect is enhanced, but the temperature distribution uniformity deteriorates
Solution Approach 1:
The cooling gas supply is segmented into multiple regions: a first cooling gas supply unit supplies cooling gas to the central region of the back surface, while a second cooling gas supply unit supplies cooling gas to the outer peripheral region. This segmentation allows independent control of cooling intensity in different areas, preventing over-cooling of the center while ensuring adequate cooling of the periphery, thus resolving the temperature distribution uniformity issue while maintaining overall cooling effect
Solution Approach 2:
Different cooling gas supply conditions are applied to different regions of the back surface. The first cooling gas supply unit provides stronger cooling to the central region, while the second cooling gas supply unit provides adjusted cooling to the outer peripheral region. This local differentiation of cooling quality ensures uniform temperature distribution across the substrate surface while maintaining effective cooling throughout
2Productivity
If the cooling gas flow rate is increased to improve contaminant removal, then the cleaning efficiency is enhanced, but the temperature control precision deteriorates
Solution Approach 1:
The cooling gas supply is divided into multiple controlled regions with independent flow rate control. Each region can be optimized to provide appropriate cooling intensity for contaminant removal while maintaining overall temperature control precision, allowing high productivity without sacrificing temperature uniformity
Solution Approach 2:
The cooling gas flow rate parameters are differentiated by region - the first cooling gas supply unit operates at a flow rate optimized for central region contaminant removal, while the second cooling gas supply unit operates at a flow rate optimized for outer peripheral region contaminant removal. This parameter differentiation enables effective contaminant removal across the entire substrate while maintaining precise temperature control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the uniformity of contaminant removal rates by maintaining a lower temperature of the cooling gas, reducing heat loss, and ensuring consistent cooling across the substrate surface, thereby enhancing the overall efficiency of the freeze cleaning process.
Implementation Method 1
a cooling gas supply unit configured to supply the cooling gas to a back surface of the substrate
Implementation Method 2
The substrate treatment device incorporates a dispersion part with a dispersion plate located at the discharge side of the cooling nozzle, which alters the flow direction of the cooling gas
Implementation Method 3
The water film is frozen by the cooling gas supplied to the substrate. When the water film freezes to form an ice film, contaminants such as particles and the like are detached from the surface of the substrate by being incorporated into the ice film
Data Source
AI summary
A substrate treatment device according to an embodiment includes a placement part that includes a placement platform on which a substrate is placeable and that is configured to rotate the placed substrate, a cooling nozzle configured to supply a cooling gas to a space between the placement platform and the substrate, a liquid supplier configured to supply a liquid to a surface of the substrate opposite to the placement platform side, and a dispersion plate located at a discharge side of the cooling gas of the cooling nozzle. The dispersion plate includes a first hole extending through the dispersion plate in a thickness direction. The first hole is located at a position overlapping a central axis of the cooling nozzle when viewed along a direction along the central axis of the cooling nozzle.