Substrate Cooling Apparatus with Segmented Heat Dissipation Plate
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Solution Overview
Problem
In semiconductor integrated circuit fabrication, the reflow process requires precise temperature control to prevent excessive heat from raising the chuck temperature, which can cause warpage or damage to the wafer, and existing cooling methods are inefficient in maintaining uniform temperature across the substrate.
Innovation Solution
A substrate cooling apparatus featuring a heat dissipation plate with radially formed grooves, an inner and outer cover with a cooling member, and an elastic unit that adjusts the height of regions based on temperature measurements to optimize heat distribution and cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling methods are used to cool the chuck, then the chuck temperature can be reduced, but the temperature distribution becomes non-uniform causing warpage or damage to the wafer
Solution Approach 1:
The cooling plate is divided into multiple independent cooling regions with separate cooling channels. Each region can be cooled independently to achieve uniform temperature distribution across the chuck surface, preventing wafer warpage while effectively removing heat.
Solution Approach 2:
Different regions of the cooling plate are designed with different cooling intensities based on the thermal load distribution of the wafer. The cooling channels are strategically positioned and sized to provide localized cooling where needed most, ensuring uniform temperature across the chuck while maintaining wafer flatness.
2Temperature
If cooling intensity is increased to prevent excessive chuck temperature rise, then chuck temperature is controlled, but cooling efficiency decreases and energy consumption increases
Solution Approach 1:
The cooling system incorporates variable flow rate control for each cooling region, allowing the cooling intensity to be dynamically adjusted based on real-time temperature measurements and process requirements. This optimized cooling approach maintains effective temperature control while minimizing energy consumption and maximizing cooling efficiency.
Solution Approach 2:
The system changes cooling parameters such as flow rate, temperature, and activation timing of different cooling regions based on process conditions. By optimizing these parameters, the system achieves effective chuck temperature control with improved cooling efficiency and reduced energy usage.
3Device complexity
If simple cooling structure is used, then device complexity is reduced, but temperature uniformity across the chuck cannot be maintained
Solution Approach 1:
The cooling plate is segmented into multiple regions with independent cooling channels, allowing precise control of temperature distribution across the chuck surface. This segmented approach achieves temperature uniformity while maintaining a relatively simple overall structure that can be manufactured cost-effectively.
Solution Approach 2:
A temperature sensor array is introduced as an intermediary between the cooling plate and control system. These sensors provide real-time temperature feedback from multiple locations on the chuck surface, enabling the control system to adjust cooling parameters to maintain uniform temperature distribution without requiring complex cooling hardware.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively prevents excessive chuck temperature rise and improves cooling efficiency by uniformly cooling the substrate, reducing the risk of warpage and damage, and maintaining consistent temperature across the wafer.
Implementation Method 1
a cooling member that is provided under the bottom wall of the inner cover and that cools the inner cover
Implementation Method 2
a heat dissipation plate that has the chuck placed on an upper surface thereof and that dissipates heat of the chuck
Implementation Method 3
an elastic unit that supports the first region and applies elastic force to the first region in the vertical direction
Data Source
AI summary
The inventive concept relates to a substrate cooling apparatus for cooling a substrate. The substrate cooling apparatus includes a chuck on which the substrate is placed and a cooling unit that cools the chuck. The cooling unit includes a heat dissipation plate that has the chuck placed on an upper surface thereof and that dissipates heat of the chuck.