Substrate treatment device and methods
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Solution Overview
Problem
In substrate processing systems, high-temperature substrates contaminate due to gas molecules adsorbed on cooled substrate holders, which are released and adhere to the substrate during cooling, leading to contamination issues even when substrates are at room temperature.
Innovation Solution
A substrate cooling device with a shield that surrounds the substrate holder, trapping gas molecules released during substrate conveyance on its side walls, reducing contamination by directing them away from the substrate surface, and using a shield and substrate holder cooling units to maintain low temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a substrate holder is cooled to low temperature in a vacuum chamber, then the substrate can be cooled quickly, but gas molecules are adsorbed onto the substrate holder surface and released when the substrate approaches, causing contamination
Solution Approach 1:
A shield is introduced as an intermediary component between the substrate and the substrate holder. The shield intercepts gas molecules released from the substrate holder and redirects them away from the substrate surface, preventing contamination while allowing the cooling function to operate effectively
Solution Approach 2:
The harmful function of the substrate holder (releasing gas molecules that contaminate the substrate) is separated from its useful function (cooling the substrate). The shield extracts and redirects the harmful gas molecules, allowing the substrate holder to focus on its cooling purpose without causing contamination
2Productivity
If the substrate holder is cooled to -100°C or below, then cooling efficiency is improved, but gas molecule adsorption on the substrate holder increases, leading to more contamination upon substrate approach
Solution Approach 1:
The shield serves as a mediator that intercepts gas molecules released from the over-cooled substrate holder. By positioning the shield between the substrate holder and the substrate, it captures the harmful gas molecules and redirects them, allowing the substrate holder to operate at lower temperatures for improved cooling efficiency without causing contamination
Solution Approach 2:
The shield converts the harmful effect of gas molecule release into a beneficial outcome by redirecting these molecules onto the shield surface itself. The gas molecules that would have contaminated the substrate are instead trapped on the shield, transforming a contamination problem into a controlled phenomenon
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces substrate contamination by trapping gas molecules on the shield's side walls, stabilizing temperature distribution, and preventing gas molecules from adhering to the substrate, thus maintaining a cleaner cooling environment.
Implementation Method 1
the shield is cooled by the shield cooling unit and the shield is provided with the side wall portion which surrounds the lateral part of the substrate mounting surface. Thus, it is possible to trap gas molecules, which are released from the substrate holder at the time of conveyance of the substrate, onto the side wall portion of the shield
Implementation Method 2
The cooling chamber can quickly cool the substrate by sandwiching a top surface and a bottom surface of the substrate between the upper cooling member and the lower cooling member
Data Source
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AI summary
The invention provides a substrate processing device and a substrate processing method for cooling a substrate, which are capable of conveying a substrate in a cleaner condition. A substrate cooling device serving as a substrate processing device of an embodiment of the invention includes: a chamber; a cooling unit which performs cooling; a substrate holder which is provided with a substrate mounting surface for mounting a substrate inside the chamber, and is cooled by the cooling unit; and a shield which is provided with a side surface portion surrounding a lateral side of the substrate mounting surface inside the chamber, and is cooled by the cooling unit. Moreover, a shield heater is provided in the vicinity of a surface on the inside of the shield.