Substrate Cooling Shield Layout for Low-Contamination Vacuum Transfer
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Solution Overview
Problem
Existing substrate cooling systems in vacuum chambers face contamination issues due to gas molecules adsorbed on substrate holders, which are released and adhere to substrates during processing, even when substrates are at room temperature, leading to contamination and instability in temperature distribution.
Innovation Solution
A substrate processing device with a shield that surrounds the substrate holder, cooled by a shield cooling unit, traps gas molecules released during substrate conveyance, reducing contamination by directing them onto the shield's side wall and upper wall, thereby minimizing adsorption on the substrate's surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a substrate holder is cooled to low temperature in a vacuum chamber, then the substrate can be cooled quickly, but gas molecules are adsorbed onto the substrate holder surface and released when the substrate approaches, causing contamination
Solution Approach 1:
A shield is introduced as an intermediary component between the substrate and the substrate holder. The shield is cooled to low temperature and positioned to surround the substrate holder, serving as a mediator that traps gas molecules released from the substrate holder before they can reach the substrate surface, thus preventing contamination while maintaining fast cooling capability
Solution Approach 2:
The shield is pre-cooled to a low temperature before substrate processing begins. This preliminary cooling creates a cold surface that actively traps gas molecules in advance, preventing them from reaching and contaminating the substrate when the substrate is later introduced into the chamber
2Reliability
If the cooling chamber is evacuated to maintain vacuum, then substrate oxidation and contamination are prevented, but gas molecules are continuously introduced during substrate conveyance and adsorb onto the substrate holder
Solution Approach 1:
The shield converts the harmful effect of gas molecule adsorption into a beneficial trapping mechanism. By cooling the shield to low temperature, it actively attracts and traps gas molecules that are released from the substrate holder, transforming the contamination problem into a controlled adsorption process that protects the substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces substrate contamination and stabilizes temperature distribution by trapping gas molecules, ensuring cleaner substrate processing and uniform cooling.
Implementation Method 1
a shield provided inside the chamber and including a side wall portion provided to surround a lateral side of the substrate mounting surface; and shield cooling unit for cooling the shield
Implementation Method 2
the substrate imparts thermal energy to the gas molecules adsorbed onto the substrate holder, whereby part of the gas molecules are freed from the substrate holder and released into a space in the vicinity of the substrate
Data Source
AI summary
The invention provides a substrate processing device and a substrate processing method for cooling a substrate, which are capable of conveying a substrate in a cleaner condition. A substrate cooling device serving as a substrate processing device of an embodiment of the invention includes: a chamber; a cooling unit which performs cooling; a substrate holder which is provided with a substrate mounting surface for mounting a substrate inside the chamber, and is cooled by the cooling unit; and a shield which is provided with a side surface portion surrounding a lateral side of the substrate mounting surface inside the chamber, and is cooled by the cooling unit. Moreover, a shield heater is provided in the vicinity of a surface on the inside of the shield.