Substrate Core Capacitor Embedding for Power Integrity and Rigidity
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Solution Overview
Problem
The challenge is to maintain mechanical rigidity and power integrity in electronic devices with integrated circuit (IC) dies, where capacitors for power integrity need to be positioned effectively without compromising the substrate's thickness and structural support, especially as IC dies become larger and capacitors are moved farther from the IC die, potentially weakening the substrate.
Innovation Solution
Embedding electronic components, such as capacitors, within the core of the substrate with additional layers that provide structural support and mechanical rigidity, allowing the component to have a thickness less than the core, thus maintaining mechanical stability and reducing the distance between the capacitor and the IC die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If capacitors are positioned farther from the IC die to maintain power integrity, then power delivery is improved, but the substrate becomes weaker and more prone to warpage
Solution Approach 1:
The patent transitions from lateral positioning of capacitors to vertical embedding within the substrate core. By placing capacitors in the thickness direction (z-axis) rather than lateral positions (x-y plane), the design achieves both power integrity through close proximity to IC die and maintains substrate strength by utilizing the core's thickness for mechanical support.
Solution Approach 2:
The capacitor is embedded within the substrate core structure, nesting the electronic component inside the mechanical support structure. This allows the capacitor to be surrounded by the core material that provides mechanical rigidity while maintaining electrical connectivity to the IC die.
2Stability of the object's composition
If the substrate core is made thicker to prevent warpage and provide mechanical rigidity, then mechanical stability is improved, but the distance between capacitor and IC die increases
Solution Approach 1:
The solution addresses the distance issue by changing from lateral separation to vertical embedding. The capacitor is positioned within the core thickness, utilizing the z-dimension to achieve close proximity to the IC die while the overall core thickness remains sufficient for mechanical rigidity.
3Ease of manufacture
If capacitors are mounted on the substrate surface, then ease of manufacturing is improved, but the substrate becomes weaker and dimple formation occurs
Solution Approach 1:
The capacitor is nested within the core during the lamination process, surrounded by prepreg layers that are subsequently cured. This embedding approach eliminates surface mounting while maintaining manufacturing feasibility through integration into the core build-up process.
Solution Approach 2:
The capacitor is positioned within the core before final curing, allowing the surrounding prepreg layers to be laminated and cured in place, providing immediate mechanical support and preventing dimple formation that would occur with surface mounting.
Data Source
AI summary
Examples are provided that relate to embedding, in a core of a substrate, an electronic component having a thickness less than a thickness of the core. One example provides an electronic device comprising a substrate comprising a core and one or more buildup layers coupled with the core, each buildup layer comprising a metal layer and a dielectric layer. The core comprises a center comprising a plurality of plies, and an additional layer comprising one or more additional plies. The electronic device further comprises an electronic component embedded in at least one of the center or the additional layer of the core. The electronic component comprises a thickness less than a thickness of the core. The electronic device further comprises an integrated circuit die coupled with the substrate and electrically connected to the electronic component.