Package Substrate Core Embedding With Pedestal Alignment Support
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge of embedding semiconductor devices, such as deep trench capacitors, within the core of a package substrate is exacerbated by the thickness mismatch between the semiconductor device and the substrate core, leading to misalignment, rotational shifting, and processing challenges due to the need for large volumes of adhesive and encapsulant, which can cause warpage and mechanical stress.
Innovation Solution
The use of a pedestal or spacer within the cavity of the substrate core to support the semiconductor device, along with a compressible material to ensure precise alignment and reduce the amount of adhesive required, thereby simplifying the fabrication process and minimizing downstream issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If semiconductor devices are embedded in substrate cores without pedestals, then device integration is achieved, but misalignment and rotational shifting occur due to thickness mismatch
Solution Approach 1:
A pedestal structure is introduced as an intermediary component between the semiconductor device and substrate core. The pedestal has a first thickness that matches the device thickness and a second thickness that matches the substrate core thickness, serving as a mediator to eliminate the thickness mismatch and prevent alignment issues during embedding.
Solution Approach 2:
The embedding structure is segmented into multiple components: the pedestal is divided into a first portion (thickness matching the device) and a second portion (thickness matching the substrate core). This segmentation allows each portion to fulfill specific functional requirements independently.
2Reliability
If large volumes of adhesive are used to embed semiconductor devices, then device support is improved, but warpage and mechanical stress increase
Solution Approach 1:
The pedestal acts as a mechanical intermediary that provides rigid support to the semiconductor device, reducing the reliance on large volumes of adhesive. This mediation minimizes the adhesive volume required while maintaining device support, thereby reducing warpage and mechanical stress in the substrate.
3Reliability
If large volumes of encapsulant are used to embed semiconductor devices, then device encapsulation is improved, but curing time and processing complexity increase
Solution Approach 1:
The pedestal serves as a structural intermediary that provides mechanical support and defines the embedding cavity boundaries. This allows the encapsulant to be applied in smaller, more controlled volumes, reducing the curing time and simplifying the encapsulation process while maintaining reliable device protection.
Data Source
AI summary
Systems, apparatus, articles of manufacture, and methods to embed semiconductor devices in cores of package substrates are disclosed. An example package substrate includes a core having a first surface and a second surface. The core includes a cavity extending between the first and second surfaces. The example package substrate further includes a semiconductor die within the cavity; a pedestal within the cavity; and an adhesive within the cavity. The adhesive surrounds the semiconductor die and the pedestal. A material of the pedestal different from a material of the adhesive.