Substrate-Core Waveguide for Contactless mm-Wave Package Links
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Solution Overview
Problem
Legacy semiconductor package implementations are limited by bandwidth and susceptible to cross-talk due to the use of discrete vias, restricting high-frequency mm-wave and sub-THz operations, and are unable to facilitate efficient communication across different sides of the substrate.
Innovation Solution
Incorporating a waveguide surrounded by a metal ring within a glass substrate core, utilizing laser-assisted etching to create fine-pitched vias and trenches, enabling contactless transitions between radiating elements on opposite sides of the substrate, and using metallization to form conductive pathways.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If discrete vias are used for signal transmission through the substrate core, then the package structure is simple to manufacture, but the bandwidth is limited and cross-talk increases
Solution Approach 1:
The signal transmission path is segmented into multiple fine-pitched vias arranged in a grid pattern, with each via contributing to the overall bandwidth. This segmentation allows the package to achieve high bandwidth density while maintaining a manufacturable structure through standardized via formation processes.
Solution Approach 2:
The waveguide structure is nested within the substrate core, with multiple functional layers (conductive layers, dielectric layers, radiating elements) nested within each other. This nesting approach enables complex high-frequency functionality while maintaining a compact package structure that is feasible to manufacture.
2Ease of manufacture
If through-hole vias are used for signal transmission, then the manufacturing process is straightforward, but cross-talk between adjacent signals increases
Solution Approach 1:
The via grid structure provides localized signal paths with controlled spacing and positioning. Each via in the grid has optimized dimensions and spacing to minimize electromagnetic coupling with adjacent vias, reducing cross-talk while maintaining ease of manufacture through standardized formation processes.
Solution Approach 2:
Dielectric materials are used as intermediaries between adjacent conductive vias and signal paths. These dielectric layers provide electrical isolation and reduce cross-talk between adjacent signals while allowing the straightforward via formation process to continue.
3Device complexity
If traditional transmission lines are used, then the design is simple, but bandwidth and frequency operation are limited
Solution Approach 1:
The transmission approach transitions from traditional planar microstrip or stripline configurations to a three-dimensional waveguide structure formed by the via grid. This dimensional change enables higher frequency operation and increased bandwidth while managing the increased design complexity through systematic via arrangement patterns.
4Reliability
If contactless transitions are implemented, then signal integrity improves, but the manufacturing process becomes more complex
Solution Approach 1:
The via grid structure creates self-forming contactless transitions where the periodic arrangement of vias naturally generates the required electromagnetic field distribution for contactless signal transmission. This self-organizing structure improves signal integrity while reducing manufacturing complexity compared to precisely positioned individual contactless elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances bandwidth density, reduces cross-talk, and allows for higher frequency operations, supporting signal frequencies in excess of 100 GHz with improved integration density and reduced impedance mismatch.
Implementation Method 1
A laser source may then be used to remove material from the glass core to form through hole vias or trenches
Implementation Method 2
A wet etch process may then be used to remove glass
Implementation Method 3
The via may then be plated or otherwise metallized to form conductive pathways
Implementation Method 4
contactless transmission within a package that combines radiating elements with vertical transitions in the package, in particular to a waveguide within a core of the package
Data Source
AI summary
Embodiments described herein may be related to apparatuses, processes, and techniques related to contactless transmission within a package that combines radiating elements with vertical transitions in the package, in particular to a waveguide within a core of the package that is surrounded by a metal ring. A radiating element on one side of the substrate core and above the waveguide surrounded by the metal ring communicates with another radiating element on the other side of the substrate core and below the waveguide surrounded by the metal ring. Other embodiments may be described and/or claimed.