Substrate Corner Cutting Structure to Prevent Laser Reflection
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Solution Overview
Problem
In the process of manufacturing substrates, the use of laser light for cutting corners can lead to reflections inside the substrate, potentially damaging electronic elements and causing product defects.
Innovation Solution
A substrate design featuring cutting sections and breaking sections, where the cutting section is formed through cutting and the breaking sections are formed under physical force, preventing laser light from being directed to the edges and thus reducing the risk of reflection and damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser light is used to cut the substrate from edge to edge, then the corner of the substrate can be cut off, but the laser light is reflected back and forth inside the substrate and easily causes the electronic elements to be burned
Solution Approach 1:
The cutting process is divided into two distinct stages: first, a cutting tool creates a cutting section through the substrate; second, breaking sections are formed at both ends of the cutting section. This segmentation prevents laser light from directly reaching the edges, as the breaking sections create a physical barrier that stops light propagation, thereby eliminating the harmful reflection effect while maintaining cutting efficiency.
Solution Approach 2:
The cutting tool performs preliminary cutting to create the cutting section before laser processing. By pre-forming the cutting section with a mechanical tool, the substrate structure is modified in advance to prevent laser light from reaching the edges during subsequent laser processing, thus avoiding the harmful reflection effect.
2Productivity
If a cutting tool is used to cut the substrate motherboard into separate substrates, then the substrate can be divided, but the corner of the substrate still requires additional laser cutting which causes the reflection problem
Solution Approach 1:
The formation of the cutting section and breaking sections is merged into a single mechanical cutting operation. The cutting tool simultaneously creates both the cutting section and the breaking sections in one pass, eliminating the need for separate laser cutting operations and reducing overall process complexity while maintaining efficient substrate division.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents laser light from reflecting inside the substrate, reducing the risk of damaging electronic elements and minimizing product defects during the cutting process.
Implementation Method 1
the breaking sections are configured to be formed under an action of a physical force
Implementation Method 2
when the laser light cuts to the edge of the substrate, the edge of the substrate will refract the laser light to an inside of the substrate
Data Source
AI summary
A substrate includes at least two edges; and at least one end portion, each end portion is connected to two adjacent edges. The end portion includes a cutting section and two breaking sections; an end of the cutting section is connected to one of the two adjacent edges through a breaking section, and another end of the cutting section is connected to another one of the two adjacent edges through another breaking section. The cutting section is configured to be formed through cutting of a tool, and the breaking sections are configured to be formed under an action of a physical force.