Substrate-Integrated Coupled Inductors for Compact RF Tuning
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Solution Overview
Problem
There is a need for improved packaging solutions that enhance electrical performance while reducing size and maintaining compactness, particularly for radio frequency (RF) functionality, where existing packages face challenges in efficiently tuning inductors for optimal signal processing and transmission.
Innovation Solution
The package incorporates a substrate with a dielectric layer and interconnects configured as multiple inductors, where one integrated device is coupled to tune another through inductive coupling, allowing real-time adjustment of inductance values to match varying signal frequencies, thereby improving performance and maintaining a thin, compact form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional packaging solutions are used for RF devices, then the package structure is simple and easy to manufacture, but the electrical performance is insufficient and the package size cannot be reduced
Solution Approach 1:
The patent embeds inductors directly within the substrate layers, nesting passive components inside the package structure rather than placing them externally. This nesting approach improves electrical performance by reducing parasitic effects while maintaining a compact form factor without requiring additional external components
Solution Approach 2:
The patent transitions from planar two-dimensional layout to three-dimensional vertical stacking by placing first and second integrated devices on opposite surfaces of the substrate with inductors formed in intermediate layers. This dimensional change enables better electrical performance and signal isolation while reducing the overall package footprint
2Reliability
If inductors are added for RF tuning functionality, then signal processing performance is improved, but the package size increases
Solution Approach 1:
The patent merges the inductor functionality with the substrate structure itself, forming inductors using the same interconnect and dielectric layers that make up the substrate. This integration eliminates the need for separate discrete inductor components, thereby improving signal processing performance while maintaining a compact package size
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support, electrical interconnection, and RF tuning functionality through the integrated inductors. This multi-functionality allows the package to achieve enhanced signal processing capabilities without adding dedicated RF tuning components that would increase package volume
3Adaptability or versatility
If real-time tuning capability is implemented, then adaptability to different frequencies is improved, but the device complexity increases
Solution Approach 1:
The patent implements dynamic tuning capability by configuring the integrated devices to control the inductance values of the embedded inductors in real-time. This allows the package to adapt to different signal frequencies by dynamically adjusting the inductor values, providing frequency agility without requiring complex mechanical or external electronic tuning mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables improved RF performance by dynamically tuning inductors to match signal frequencies, enhancing signal processing and transmission efficiency while maintaining a compact package size, thus addressing the need for better performing and smaller packages.
Implementation Method 1
one integrated device is coupled to tune another through inductive coupling, allowing real-time adjustment of inductance values to match varying signal frequencies
Data Source
AI summary
A package comprising a substrate, a first integrated device coupled to a first surface of the substrate, and a second integrated device coupled to a second surface of the substrate. The substrate includes a dielectric layer and a plurality of interconnects. The plurality of interconnects includes a first plurality of interconnects configured as a first inductor and a second plurality of interconnects configured as a second inductor. The first integrated device is configured to be coupled to the first inductor. The second integrated device is configured to be coupled to the second inductor. The second integrated device is configured to tune the first inductor through the second inductor.