Substrate Handling System Dynamic Coupling for Thermal Conditioning
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Solution Overview
Problem
The existing substrate handling systems in lithographic apparatuses face limitations in thermal conditioning during pre-alignment, as the substrate's rotation and movement disrupt heat transfer, either through ineffective gas films or the need to lift the substrate from the thermal conditioning device.
Innovation Solution
A substrate handling system with a holder, rotation device, and mover that allows for simultaneous thermal conditioning and precise alignment, using a coupling device to manage contact and decoupling for efficient heat exchange and alignment processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the substrate is rotated using a gas film between the substrate and thermal conditioning device, then the substrate can be rotated during pre-alignment, but the heat transfer efficiency deteriorates because gas film is not as effective as physical contact
Solution Approach 1:
The system dynamically switches between two operational modes: a first mode where the holder is coupled to both the rotation device and thermal conditioning device for simultaneous rotation and heating, and a second mode where the holder is decoupled from the rotation device and coupled only to the thermal conditioning device for optimized thermal conditioning. This dynamic reconfiguration resolves the contradiction by allowing the system to have both rotation capability and thermal efficiency at different times.
2Ease of operation
If the substrate is lifted from the thermal conditioning device to be moved or rotated, then the substrate can be repositioned, but the thermal conditioning is negatively affected due to loss of physical contact
Solution Approach 1:
The system uses dynamic coupling and decoupling mechanisms that allow the holder to be simultaneously connected to both the rotation device and thermal conditioning device. This eliminates the need to lift the substrate from the thermal conditioning device during rotation, as both operations can occur concurrently through the coordinated coupling system.
Solution Approach 2:
The system merges the rotation function and thermal conditioning function into a single integrated operational mode where both functions occur simultaneously. The holder is coupled to both the rotation device and thermal conditioning device at the same time, combining previously separate operations into one unified process that avoids interrupting thermal contact.
3Temperature
If physical contact is made between substrate and thermal conditioning device, then heat transfer is improved, but the substrate cannot be easily rotated or moved without lifting it
Solution Approach 1:
The system employs dynamic coupling mechanisms that can be configured in different states. In the first operational state, the holder is coupled to both the rotation device and thermal conditioning device, enabling simultaneous rotation and thermal conditioning. In the second state, the holder is decoupled from the rotation device and coupled only to the thermal conditioning device, optimizing thermal contact. This dynamic reconfiguration resolves the contradiction by allowing both physical contact for heat transfer and rotation capability through systematic coupling changes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal conditioning efficiency by maintaining heat transfer during substrate rotation and movement, improving alignment accuracy and thermal management within the lithographic apparatus.
Implementation Method 1
a thermal conditioning device for conditioning a temperature of the substrate... The holder is arranged to be coupled to the rotation device and to the thermal conditioning device... such that the holder is arranged to be in thermal contact with the thermal conditioning device
Data Source
AI summary
A substrate handling system for handling a substrate, the substrate handling system including a holder for holding the substrate, a rotation device for rotating the holder around an axis perpendicular to a plane, and a mover for moving the holder along a path in the plane relative to the axis. Further, there is provided a lithographic apparatus including the substrate handling system. The substrate handling system may include a coupling device arranged to couple the holder to the mover or the rotation device in a first situation. The coupling device may be arranged to decouple the holder from the mover or rotation device in a second situation.