Substrate Cover for Charged Particle Beam Alignment
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Solution Overview
Problem
In electron beam pattern writing, the electrified charge on the substrate causes beam deflection and blurring, and existing alignment methods require additional steps and are not precise until after pattern development and etching.
Innovation Solution
A substrate cover with a frame-like member and contact points is used to electrically connect the substrate to ground potential, preventing charge buildup and allowing precise alignment using marks on the cover before writing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional alignment methods using alignment marks on the stage are used, then alignment can be performed before writing, but the relative position between the substrate and stage may shift during writing, requiring additional inspection steps after processing
Solution Approach 1:
The patent introduces a substrate cover as an intermediary component that includes alignment marks and electrically connects the substrate to ground. This mediator ensures stable alignment by preventing substrate displacement during writing and provides continuous electrical grounding, eliminating the need for post-processing alignment checks.
2Device complexity
If the substrate is left floating without electrical connection to ground, then the substrate structure remains simple, but the electrified charge causes beam deflection and blurring
Solution Approach 1:
The substrate cover serves multiple functions simultaneously: it provides electrical grounding to prevent charge buildup, offers mechanical support to the substrate, and includes alignment marks for precise positioning. This multi-functional design eliminates the need for separate grounding mechanisms while maintaining writing precision.
3Reliability
If contact points are allocated on the target workpiece for earthing, then the charged layer can be connected to ground potential, but the glass substrate exposed on the side surface also becomes charged
Solution Approach 1:
The patent extracts the grounding function from the substrate itself and implements it through a separate substrate cover. The cover makes electrical contact with the substrate at the bottom surface, providing grounding without exposing side surfaces to electron beam irradiation, thus preventing side surface charging while maintaining effective earthing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents beam deflection and allows for immediate detection and correction of substrate position shifts during writing, reducing errors and simplifying the process by eliminating the need for post-processing alignment checks.
Implementation Method 1
a contact point part (16) configured to be provided on an undersurface of the frame-like member (12), in order to be electrically connected to the substrate (101)
Implementation Method 2
earthing (or 'ground connection') is made for the charged layer
Implementation Method 3
the electron beam 330 that left a charged particle source 430 and has passed through the opening 411 is deflected by a deflector
Implementation Method 4
an electrical conducting material comprising a layer formed on the surface of the target workpiece, such as a shading film of chromium (Cr), will be charged
Implementation Method 5
a frame-like member configured to be placed on a substrate which is to be written using a charged particle beam
Data Source
AI summary
A substrate cover includes a frame-like member configured to be placed on a substrate which is to be written using a charged particle beam, and to have an outer perimeter dimension larger than a perimeter end of the substrate and an inner perimeter dimension, being a border between the frame-like member and an inner opening portion, smaller than the perimeter end of the substrate, and a contact point part configured to be provided on an undersurface of the frame-like member, in order to be electrically connected to the substrate.