Substrate Processing Cup Cleaning via Overflow Mechanism

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Solution Overview

Problem

In substrate processing apparatuses, residual processing liquids can react to form foreign matters like crystals, which adhere to the peripheral wall portions of cups, leading to contamination and processing inefficiencies.

Innovation Solution

A substrate processing apparatus is designed with a cleaning liquid supply unit that overflows cleaning liquid from the peripheral wall portion to an adjacent cup, effectively cleaning the peripheral wall and removing attached foreign matters by using a mixed solution of sulfuric acid and hydrogen peroxide, and incorporating a heat exchange unit to enhance cleaning efficacy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple cups are disposed adjacent to each other to recover different processing liquids, then the substrate processing apparatus can handle multiple processing liquids simultaneously, but residual processing liquids from adjacent cups can react to form foreign matters that adhere to the peripheral wall portions

Engineering Contradiction:
Improveability to handle multiple processing liquidsVSAvoidforeign matters formed by chemical reaction
Core Design Contradiction:
Adaptability or versatilityVSObject-generated harmful factors

Solution Approach 1:

The invention extracts the harmful residual processing liquids from the recovery portion by introducing cleaning liquid that flows through the peripheral wall portion, separating the cleaning function from the recovery function to prevent foreign matter formation

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention introduces cleaning liquid as an intermediary substance that mediates between the residual processing liquids in adjacent cups, preventing their direct contact and chemical reaction by flushing through the peripheral wall portion

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If cleaning liquid is supplied to the recovery portion to clean the peripheral wall portion, then foreign matters can be removed, but the cleaning liquid may mix with residual processing liquids causing contamination

Engineering Contradiction:
Improvecleaning effectivenessVSAvoidcontamination from mixing
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

Instead of trying to prevent cleaning liquid from contacting residual processing liquids, the invention inverts the approach by using the cleaning liquid flow to actively flush out and remove residual processing liquids from the peripheral wall portion before they can react

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The invention performs preliminary cleaning action by supplying cleaning liquid to the recovery portion before foreign matters can form from the reaction of residual processing liquids, preventing the harmful effect rather than treating it after occurrence

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus efficiently removes foreign matters from the peripheral wall portions, preventing contamination and ensuring continuous, reliable substrate processing operations by utilizing a cleaning liquid that dissolves and removes crystals, and the heat exchange further enhances the cleaning process.

Implementation Method 1

utilizing a cleaning liquid that dissolves and removes crystals

Methodology Applied
Scientific EffectDissolution: Solvation

Implementation Method 2

incorporating a heat exchange unit to enhance cleaning efficacy

Methodology Applied
Scientific EffectHeat transfer: Heat Exchanger

Data Source

PatentUS10475671B2Substrate processing apparatus and method of cleaning substrate processing apparatus
Publication Date: 2019.11.12 TOKYO ELECTRON LTD
  • US10475671B2 patent drawing
  • US10475671B2 patent drawing
  • US10475671B2 patent drawing

AI summary

Disclosed is a substrate processing apparatus including: a holding unit configured to hold a substrate; a processing liquid supply unit configured to supply a first processing liquid and a second processing liquid to the substrate; a first cup configured to recover the first processing liquid; a second cup disposed adjacent to the first cup and configured to recover the second processing liquid; a recovery portion defined by a peripheral wall portion that is erected on a bottom portion of the first cup; and a cleaning liquid supply unit configured to supply a cleaning liquid to the recovery portion. The peripheral wall portion is cleaned by causing the cleaning liquid supplied by the cleaning liquid supply unit to overflow from the peripheral wall portion to the second cup side.