Power Module Substrate Layout for Symmetrical Current Distribution

The patent applies asymmetry principle by intentionally designing asymmetric current track arrangements and semiconductor component placements that compensate for thermal effects. The current tracks are routed with different lengths and configurations to balance power loss distribution across parallely connected semiconductor components, preventing asymmetric heating while maintaining compact housing dimensions.

The patent implements local quality by creating region-specific thermal management zones within the housing. Different areas of the substrate and housing are designed with varying thermal conductivities and heat dissipation characteristics. Cooling bodies are strategically positioned to provide enhanced cooling in high-power-loss regions, ensuring uniform temperature distribution across the module.

The patent introduces intermediary thermal management elements between adjacently arranged semiconductor components. These include thermally conductive substrates with optimized heat diffusion paths, intermediate cooling structures, and thermally conductive adhesives that act as heat transfer mediators. These intermediaries prevent direct thermal coupling between components while maintaining electrical connectivity, thereby reducing mutual heating effects.

The patent transitions from two-dimensional planar arrangement to three-dimensional thermal management architecture. Multiple cooling bodies are positioned at different vertical levels and angles relative to the semiconductor components. Heat dissipation is achieved not only through the substrate plane but also through vertical heat sinks and side-mounted cooling structures, effectively utilizing three-dimensional space for thermal management.