Substrate Cutting Device With Adaptive Pressing Force Control
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Solution Overview
Problem
Conventional cutting devices for substrates apply inconsistent pressing forces due to varying substrate thicknesses, leading to shocks and adverse effects on mounted components during the cutting process.
Innovation Solution
A cutting device with a movable cutting part and a pressing part, equipped with force and displacement sensors, adjusts the pressing force based on substrate feedback to maintain consistent pressure, using air cylinders and servomotors to control the cutting process, ensuring precise control and adaptation to different substrate thicknesses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cutting devices press substrates with fixed pressing force, then the cutting device structure is simple, but substrates of different thicknesses receive inconsistent pressing force causing shocks to mounted components
Solution Approach 1:
The pressing force control system uses feedback from force sensors and displacement sensors to continuously monitor substrate thickness and adjust the pressing force in real-time, ensuring consistent pressing force regardless of substrate thickness variations, thereby preventing shocks to mounted components
Solution Approach 2:
The pressing force control system dynamically adjusts the pressing force based on detected substrate thickness, transitioning from a static fixed pressing force to a dynamic adaptive pressing force that responds to varying substrate conditions
2Reliability
If the pressing force is increased to ensure consistent pressure on thin substrates, then component performance is protected, but thick substrates may be damaged or the cutting precision deteriorates
Solution Approach 1:
The system changes the pressing force parameter dynamically based on substrate thickness detection, using lower pressing force for thick substrates and appropriate pressing force for thin substrates, thereby maintaining cutting precision across different substrate types while protecting components
3Manufacturing precision
If force sensors and displacement sensors are added to measure and adjust pressing force, then consistent pressing force is achieved, but the device complexity increases
Solution Approach 1:
Force sensors and displacement sensors provide real-time feedback on pressing force and substrate position, enabling the control system to automatically adjust and maintain consistent pressing force, with the added complexity justified by the significant improvement in manufacturing precision
Solution Approach 2:
The patent replaces manual or mechanical pressing force adjustment with an automated control system using sensors and actuators, substituting mechanical intuition with precise electronic sensing and control to achieve consistent pressing force
Data Source
AI summary
Provided is a cutting device that prevents a variation of shocks or impacts applied to a substrate during a cutting operation. The cutting device includes a pressing part; a cutting part disposed so as to move with respect to the pressing part so as to contact the substrate on an opposite side of the pressing part to thereby sandwich the substrate between the cutting part and the pressing part to shear the substrate; a first force generation part for generating pressing force to press the pressing part against the substrate; and a first adjustment part for adjusting the pressing force in response to the force applied from the substrate to the pressing part when the pressing part presses the substrate with the first force generation part.