Substrate Cutting with Structural Bodies to Crush Metal Burr
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Solution Overview
Problem
The cutting of substrates with exposed metal can result in burr formation, which may interfere with chip mounting, cause short-circuits, or adhere to the device or cutting apparatus, due to the existing methods not effectively addressing burr removal during the cutting process.
Innovation Solution
A processing method involving the disposition of two structural bodies along the edges of the cutting line, with a cutting blade passing between them to cut the substrate, ensuring that any generated burr is crushed and not left on the device chip, using an annular cutting grindstone with the structural bodies' gap equal to or smaller than the grindstone thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate having metal exposed is cut by a cutting blade from the back surface side, then the substrate can be cut along the cutting line, but metallic burr is generated at the cut portion
Solution Approach 1:
Two structural bodies are disposed on the metal along respective edges of the cutting line before the cutting operation. This preliminary positioning of structural bodies creates a confined space that prevents burr formation during the subsequent cutting process, rather than attempting to remove burrs after cutting occurs.
Solution Approach 2:
The invention converts the potentially harmful burr formation into a beneficial outcome by using the cutting blade and structural bodies to crush and contain the metal debris. The burr that would normally be a defect is instead contained within the gap between structural bodies, preventing it from adhering to the device chip.
2Strength
If the metal is disposed on the back surface side of the substrate before cutting, then the metal serves as reinforcement or heat sink, but burr interferes with mounting or causes short-circuit
Solution Approach 1:
Two structural bodies are introduced as intermediary elements between the cutting blade and the metal on the substrate. These structural bodies create a controlled environment that captures metal debris during cutting, preventing the burr from interfering with mounting operations or causing electrical short-circuits between electrodes.
3Ease of manufacture
If the cutting blade is made to cut into the substrate from the back surface side, then the cutting can be performed, but burr extends from the cut portion and may fall off and adhere to device chip or cutting apparatus
Solution Approach 1:
The invention segments the cutting zone by introducing two structural bodies that divide the space around the cut line. This segmentation creates a confined gap that captures and contains metal burr, preventing it from falling off and adhering to the device chip or cutting apparatus. The cutting process itself remains simple, but the burr management is achieved through this spatial segmentation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively prevents the formation of metallic burrs on device chips, ensuring proper mounting and preventing potential short-circuits by crushing the burr between the cutting blade and structural bodies during the cutting process.
Implementation Method 1
any burr generated is crushed between the cutting blade and the structural bodies
Data Source
AI summary
A processing method for a substrate having a metal exposed and having cutting lines of a predetermined width set thereon includes: a structural body disposing step of disposing two structural bodies on the metal along respective edges in regard of the width direction of the cutting line, with a gap corresponding to the width therebetween; and a cutting step of causing a cutting blade to cut into the substrate from between the two structural bodies to cut the substrate along the cutting lines, after the structural body disposing step is carried out.