Package Substrate Cutting with Chemical Liquid to Suppress Burrs
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Solution Overview
Problem
Existing package substrate processing methods face inefficiencies in burr removal, leading to potential short circuits and defective bonding, with current techniques either requiring low water pressure for burr removal, resulting in insufficient removal, or involving multiple cutting operations that reduce processing efficiency and risk burr reformation.
Innovation Solution
A method involving the use of a cutting liquid containing an organic acid and an oxidizing agent during the cutting process to reduce burr formation, followed by fluid spraying to remove burrs, allowing for reduced fluid pressure and single-pass cutting without adhesive tape breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If water is sprayed at high pressure to remove burrs, then burr removal effectiveness is improved, but adhesive tape breakage and substrate scattering occur
Solution Approach 1:
The cutting liquid is applied to the division line before cutting occurs, pre-conditioning the electrode surface to minimize burr formation. This preliminary chemical treatment reduces the need for aggressive post-cutting water spraying, allowing burr removal at lower pressures that do not break the adhesive tape.
Solution Approach 2:
The cutting liquid acts as an intermediary substance between the cutting blade and the electrode. It modifies the interaction at the cutting interface to reduce burr generation, and subsequently serves as a medium that enables effective but gentle burr removal without requiring high-pressure water that would damage the adhesive tape.
2Reliability
If water pressure is reduced to prevent substrate scattering and tape breakage, then processing reliability is improved, but burr removal effectiveness deteriorates
Solution Approach 1:
By applying cutting liquid before cutting, the electrode surface is pre-treated to minimize burr formation. This preliminary action reduces the burden on the subsequent water spraying step, enabling effective burr removal at lower pressures that maintain processing reliability.
Solution Approach 2:
The cutting liquid changes the physical-chemical parameters of the electrode surface at the division line. This modification allows the electrode to be more easily cleaned at lower water pressures, transforming the relationship between water pressure and burr removal effectiveness.
3Manufacturing precision
If multiple cutting operations are performed to remove burrs, then burr removal completeness is improved, but processing efficiency deteriorates
Solution Approach 1:
The cutting liquid is applied before cutting to prevent excessive burr formation in the first place. This preliminary prevention reduces the need for multiple corrective cutting operations, achieving complete burr removal in a single cutting pass and maintaining high processing efficiency.
Solution Approach 2:
Instead of relying on multiple cutting operations to remove burrs, the method converts the potential harm of burr formation into a benefit by using the cutting liquid to chemically assist in minimizing burr creation and facilitating their easy removal, thereby eliminating the need for repeated mechanical cutting.
4Manufacturing precision
If cutting liquid containing organic acid and oxidizing agent is used, then burr formation is suppressed and removal is facilitated, but chemical complexity of the process increases
Solution Approach 1:
The cutting liquid modifies the chemical parameters of the cutting environment by introducing organic acid and oxidizing agent. These chemical parameter changes suppress burr formation and facilitate burr removal, accepting increased chemical complexity as a trade-off for significantly improved manufacturing precision in burr control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses burr formation and facilitates efficient burr removal with reduced fluid pressure, preventing adhesive tape breakage and maintaining processing efficiency.
Implementation Method 1
supplying a cutting liquid containing an organic acid and an oxidizing agent to a cutting area
Implementation Method 2
supplying a cutting liquid containing an organic acid and an oxidizing agent to a cutting area where the package substrate is to be cut
Implementation Method 3
removing burrs produced from the electrode in the cutting step by spraying a fluid to the package substrate along the division line after performing the cutting step
Data Source
AI summary
A package substrate processing method for processing a package substrate having a division line, an electrode being formed on the division line includes a cutting step of cutting the package substrate along the division line by using a cutting blade and a burr removing step of removing burrs produced from the electrode in the cutting step by spraying a fluid to the package substrate along the division line after performing the cutting step. The cutting step includes a step of supplying a cutting liquid containing an organic acid and an oxidizing agent to a cutting area where the package substrate is to be cut by the cutting blade.