Electronic Component Substrate Cutting and Device Mounting
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Solution Overview
Problem
Existing methods for producing electronic components with substrate-type terminals are prone to detachment and connection splitting due to impact during the cutting process, as described in Japanese Unexamined Patent Application Publication No. 2013-38291.
Innovation Solution
A method involving supporting a substrate with a first support member, cutting it into substrate-type terminals while maintaining support, and mounting devices on the terminals after cutting, ensuring the terminals are spaced apart to absorb impact and prevent detachment, with optional use of solder bonding agents and dicer processing to prevent burrs and ensure stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate is cut into substrate-type terminals before mounting devices, then the cutting process can be performed with stable support, but the devices are not yet protected from impact during cutting
Solution Approach 1:
The substrate is supported on a support member before the cutting process begins. This preliminary support arrangement ensures that when the substrate is later divided into substrate-type terminals, the terminals remain stably supported and devices mounted on them are protected from impact and detachment.
2Reliability
If devices are mounted on substrate-type terminals after cutting, then impact during cutting cannot cause detachment, but the terminals must be spaced apart to absorb impact
Solution Approach 1:
The substrate-type terminals are spaced apart at predetermined intervals on the support member before devices are mounted. This spacing acts as a cushion or buffer zone that absorbs impact forces during the cutting process, preventing detachment of devices from the terminals while still allowing for compact device arrangement.
Data Source
AI summary
A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal is performed such that the substrate-type terminal includes a substrate body including a rectangular or substantially rectangular first principal surface extending in first and second directions perpendicular or substantially perpendicular to each other. The device is disposed on the first principal surface. The method includes supporting a substrate that is to become an assembly in which the plurality of substrate-type terminals are arranged in a matrix using a first support member, cutting the substrate supported by the first support member into the plurality of substrate-type terminals, and mounting the device on the first principal surface of the substrate body of each of the plurality of substrate-type terminals obtained by cutting.