Substrate Cutting Using Short-Pulse Laser Beam Swing
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Solution Overview
Problem
Conventional substrate cutting apparatuses face difficulties in smoothly cutting thin substrates due to the challenges of generating micro-cracks by temperature differences, making it hard to cut substrates with reduced thickness effectively.
Innovation Solution
A substrate cutting apparatus and method utilizing a short-pulse laser beam that swings along a predetermined cutting line, with a beam swing unit and a transfer unit to move the cutting section, allowing for precise cutting without micro-crack generation, and optionally using a CO2 laser for pre-heating to control crack formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a CO2 laser with cooling means is used to generate micro-cracks by temperature difference, then cutting capability for conventional substrates is achieved, but cutting effectiveness deteriorates when substrate thickness is reduced below 0.3 mm
Solution Approach 1:
The patent changes the fundamental parameters of the laser system by switching from a CO2 laser (infrared wavelength) to a short-pulse laser (200-900 nm wavelength range). This parameter change enables effective cutting of thin substrates by altering how the laser energy interacts with the glass material, allowing absorption and direct bond breaking without relying on thermal stress-induced micro-cracks that fail for substrates thinner than 0.3 mm
Solution Approach 2:
The patent employs periodic action through short-pulse laser irradiation with pulse frequencies between 0.1 MHz and 100 MHz. This high-frequency pulsing delivers energy in discrete intervals, allowing the laser to break molecular bonds through cumulative impact rather than continuous heating. The periodic delivery of energy enables precise control over the cutting process while maintaining substrate integrity for thin materials
2Reliability
If a short-pulse laser with beam swing unit is used to physically remove substrate material, then cutting effectiveness for thin substrates is improved, but device complexity increases due to additional components
Solution Approach 1:
The patent introduces dynamics by implementing a beam swing unit that oscillates the laser beam back and forth across the cutting line. This dynamic beam delivery method transforms a stationary laser system into one with controlled motion, allowing the laser to physically remove material along the entire cutting path through repeated scanning. The swing unit's oscillation pattern ensures uniform material removal while maintaining system compactness
Solution Approach 2:
The beam swing unit serves multiple functions: it delivers the laser beam along the cutting path, controls the scanning speed, defines the cutting width, and enables various cutting patterns (straight, curved, oval). This multi-functional component reduces the need for additional specialized mechanisms, thereby limiting the increase in device complexity despite the added capability for reliable thin substrate cutting
3Manufacturing precision
If additional CO2 laser is used for pre-heating before short-pulse laser cutting, then crack formation is controlled, but energy consumption and process time increase
Solution Approach 1:
The patent applies preliminary action by using a CO2 laser to pre-heat the substrate along the intended cutting line before the short-pulse laser performs the actual cutting. This pre-heating softens the glass material and reduces thermal shock during the subsequent rapid pulsed irradiation, thereby controlling crack formation and improving cut quality. The preliminary thermal preparation enables the main cutting process to proceed with fewer defects
Solution Approach 2:
The dual-laser system operates in continuous sequence with the CO2 laser pre-heating followed immediately by the short-pulse laser cutting. This continuous action eliminates idle time between heating and cutting operations, ensuring that the substrate remains in the optimal temperature state throughout the process. The seamless transition between the two laser stages maximizes energy efficiency by maintaining useful thermal action throughout
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables stable and effective cutting of substrates with thicknesses as low as 0.3 mm without micro-crack formation, maintaining substrate integrity and allowing for various cutting patterns, including straight, curved, and oval shapes.
Implementation Method 1
A substrate cutting apparatus and method utilizing a short-pulse laser beam that swings along a predetermined cutting line
Implementation Method 2
the conventional substrate cutting apparatus may apply heat to the substrate along a cutting line by using a CO2 gas laser to generate compression stress
Implementation Method 3
the conventional substrate cutting apparatus may cool the heated portion with the cooling means to generate tensile stress
Data Source
AI summary
A substrate cutting apparatus includes a stage configured to support a substrate, a first laser generator configured to emit a first laser beam toward the substrate, the first laser beam being a short-pulse laser beam, and a beam swing unit disposed on a beam path of the first laser beam, the beam swing unit being configured to swing the first laser beam in a predetermined light irradiating section on the substrate, the light irradiating section on the substrate including at least one of a curved line section and a straight line section.