Integrated Substrate Cutting and Polishing With Automatic Stacking

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Solution Overview

Problem

Existing substrate cutting machines lack automation, flexibility, and stability, leading to inefficiencies in cutting, polishing, stacking, and unloading processes, which affects production quality and efficiency.

Innovation Solution

An integrated machine that combines laser cutting, polishing, automatic stacking, and unloading functions, utilizing a cantilever mechanical laser arm for flexible cutting and a polishing device to smooth cut edges, along with an automatic stacking device and finished product placement racks for efficient handling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Extent of automation

If traditional substrate cutting machines are used, then manual operation is required, but automation level is low and production efficiency is reduced

Engineering Contradiction:

Improveautomation levelVSAvoidproduction efficiency

Core Design Contradiction:

Extent of automationVSProductivity

Solution Approach 1:

The patent combines cutting, polishing, stacking, and unloading functions into a single integrated machine system. The cutting device, polishing device, stacking device, and unloading device operate sequentially within one machine, eliminating the need for multiple separate operations and significantly improving both automation level and production efficiency.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated machine performs multiple functions including cutting substrates of various sizes, polishing cut edges, stacking finished products, and unloading materials. This multi-functional design allows one machine to replace several separate devices, achieving high automation while maintaining versatile productivity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If fixed cutting tools are used, then cutting speed is limited, but adaptability to different substrate sizes is reduced

Engineering Contradiction:

Improvehandling diverse substrate sizesVSAvoidcutting speed

Core Design Contradiction:

Adaptability or versatilityVSSpeed

Solution Approach 1:

The patent employs a movable cutting tool that can dynamically adjust its position and orientation based on the size and shape of the substrate. The cutting tool is mounted on a movable platform that can reposition itself, allowing the machine to adapt to different substrate dimensions while maintaining high cutting speed through automated motion control.

Inventive Principle:

Principle #15Dynamics

3Device complexity

If cutting and polishing are performed separately, then production process is simplified, but number of devices and occupied space increase

Engineering Contradiction:

Improvenumber of devicesVSAvoidoccupied space

Core Design Contradiction:

Device complexityVSArea of stationary object

Solution Approach 1:

The patent integrates the cutting device and polishing device into a single machine system. The polishing device is positioned adjacent to the cutting tool, allowing immediate polishing of cut edges without removing the substrate from the machine. This merging of functions reduces the number of separate devices and minimizes occupied space while maintaining process simplicity.

Inventive Principle:

Principle #5Merging (Combining)

4Productivity

If manual stacking and unloading are used, then operation flexibility is maintained, but labor costs and time consumption increase

Engineering Contradiction:

Improvehandling efficiencyVSAvoidtime consumption

Core Design Contradiction:

ProductivityVSLoss of time

Solution Approach 1:

The stacking device and unloading device are designed to operate automatically without manual intervention. The stacking device automatically stacks finished substrates onto pallets or racks, while the unloading device automatically removes finished products from the machine. This self-service capability eliminates manual labor, reduces time consumption, and improves handling efficiency.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The integrated machine achieves automated operation with reduced manual intervention, improves production efficiency by handling diverse substrate sizes, enhances quality through polishing, and optimizes logistics with automatic stacking and unloading, thereby reducing costs and waste.

Implementation Method 1

utilizing a cantilever mechanical laser arm for flexible cutting

Methodology Applied

Scientific EffectLaser: Laser

Implementation Method 2

a polishing device to polish the edges of the cut substrate

Methodology Applied

Scientific EffectAbrasion: Abrasion

Data Source

PatentUS12275083B2Integrated machine for automatic cutting, polishing, stacking and unloading of substrates

Publication Date: 2025.04.15 SOUTHWEST PETROLEUM UNIV

AI summary

An integrated machine for automatic cutting, polishing, stacking, and unloading of substrates, including a laser cutting machine, a mechanical laser arm, a polishing machine, a polishing device, a first finished product placement rack, a second finished product placement rack, and an automatic stacking device. The mechanical laser arm is fixed on the frame of the laser cutting machine, the polishing device is fixed on the polishing machine, and the first finished product placement rack and the second finished product placement rack are arranged on both sides of the automatic stacking device. The present disclosure can achieve cutting the substrates of any size, and can automatically polish the edges of the cut substrates. The present disclosure has the characteristics of automation, integration, and multi-functionality, effectively reducing the number of supporting equipment and occupying space.